Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11658044 | Thermally conductive structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2023-05-23 |
| 11574886 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2023-02-07 |
| 11179040 | Attachable monitoring device | Shih-Chien Lin, Ho-Yi Chang, Kai-Chieh Chang | 2021-11-23 |
| 11125940 | Method of fabrication polymer waveguide | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2021-09-21 |
| 11088058 | Method for forming semiconductor package using carbon nano material in molding compound | Ying-Hao Kuo, Kuo-Chung Yee | 2021-08-10 |
| 10983278 | Adhesion promoter apparatus and method | Ying-Hao Kuo, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2021-04-20 |
| 10957559 | Thermally conductive structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2021-03-23 |
| 10859908 | Method to fabricate mask-pellicle system | Sheng-Chi Chin, Yuan-Chih Chu | 2020-12-08 |
| 10861817 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2020-12-08 |
| 10784227 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2020-09-22 |
| 10748825 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2020-08-18 |
| 10539751 | Optical bench on substrate | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2020-01-21 |
| 10541154 | Thermally conductive structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2020-01-21 |
| 10510707 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2019-12-17 |
| 10490492 | Method for forming semiconductor package using carbon nano material in molding compound | Ying-Hao Kuo, Kuo-Chung Yee | 2019-11-26 |
| 10434196 | Multivalent saccharide complex, radioactive multivalent saccharide complex contrast agent, and use thereof | Hung-Man Yu, Wuu-Jyh Lin, Mei-Hui Wang | 2019-10-08 |
| 10440841 | Electronic device | Shih-Po Chien, Yi-Ting Liu, Yu-Jing Liao, I-Cheng Chuang, Chi-Jer Wang +1 more | 2019-10-08 |
| 10408998 | Method of fabrication polymer waveguide | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2019-09-10 |
| 10393600 | Portable electronic device and sensing method thereof | Yu-Jing Liao, Shih-Po Chien, Yi-Ting Liu | 2019-08-27 |
| 10387708 | Physiological characteristic identifying module | Shih-Po Chien, Chi-Jer Wang | 2019-08-20 |
| 10276471 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2019-04-30 |
| 10275631 | Electronic device and physiological characteristic identifying module | Shih-Po Chien, Chi-Jer Wang | 2019-04-30 |
| 10275065 | Multi-sensing system, portable electronic device and touch-sensing method | Yi-Ting Liu, Shih-Po Chien, Chin-Kuei Wen, Jui-Liang Chen, Yu-Jing Liao +2 more | 2019-04-30 |
| 10180547 | Optical bench on substrate | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2019-01-15 |
| 10177082 | Method for forming semiconductor package using carbon nano material in molding compound | Ying-Hao Kuo, Kuo-Chung Yee | 2019-01-08 |