Issued Patents All Time
Showing 26–50 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10143383 | Attachable monitoring device | Shih-Chien Lin, Ho-Yi Chang, Kai-Chieh Chang | 2018-12-04 |
| 10137603 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2018-11-27 |
| 10135224 | Apparatus and method of forming chip package with waveguide for light coupling having a molding layer for a laser die | Ying-Hao Kuo, Kuo-Chung Yee | 2018-11-20 |
| 10082626 | Adhesion promoter apparatus and method | Ying-Hao Kuo, Kai-Fang Cheng, Hai-Ching Chen, Tien-I Bao | 2018-09-25 |
| 9960099 | Thermally conductive molding compound structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2018-05-01 |
| 9946306 | Electronic assembly and assemblying method | Chu-Chun Lo, Cheng-Min Lin | 2018-04-17 |
| 9910217 | Method of fabrication polymer waveguide | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2018-03-06 |
| 9902092 | Vacuum carrier module, method of using and process of making the same | Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2018-02-27 |
| 9865481 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2018-01-09 |
| 9859199 | Method for forming semiconductor package using carbon nano material in molding compound | Ying-Hao Kuo, Kuo-Chung Yee | 2018-01-02 |
| 9835940 | Method to fabricate mask-pellicle system | Sheng-Chi Chin, Yuan-Chih Chu | 2017-12-05 |
| 9831634 | Apparatus and method of forming chip package with waveguide for light coupling | Ying-Hao Kuo, Kuo-Chung Yee | 2017-11-28 |
| 9799528 | Apparatus and package structure of optical chip | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2017-10-24 |
| 9679151 | Method for encrypting on-screen contents, electronic apparatus using the method and recording medium using the method | Kuan-Wei Li | 2017-06-13 |
| 9576930 | Thermally conductive structure for heat dissipation in semiconductor packages | Ying-Hao Kuo, Kuo-Chung Yee | 2017-02-21 |
| 9568677 | Waveguide structure and method for fabricating the same | Ying-Hao Kuo, Hai-Ching Chen, Tien-I Bao | 2017-02-14 |
| 9490148 | Adhesion promoter apparatus and method | Ying-Hao Kuo, Kai-Feng Cheng, Hai-Ching Chen, Tien-I Bao | 2016-11-08 |
| 9488779 | Apparatus and method of forming laser chip package with waveguide for light coupling | Ying-Hao Kuo, Kuo-Chung Yee | 2016-11-08 |
| 9478475 | Apparatus and package structure of optical chip | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2016-10-25 |
| 9419156 | Package and method for integration of heterogeneous integrated circuits | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2016-08-16 |
| 9374515 | Electronic element supporting base and electronic device | I-Te Chen, Wei-Cheng Liu, Jia-Yuan Hsu, Jen-Cheng Lai, Cheng-Chieh Chuang +1 more | 2016-06-21 |
| 9244223 | Light coupling formation in a waveguide layer | Ying-Hao Kuo, Kuo-Chung Yee | 2016-01-26 |
| 9107122 | Method and apparatus for correcting wireless signal quality | Chia-Lung Liu, Ming-Chia Lee | 2015-08-11 |
| 9099623 | Manufacture including substrate and package structure of optical chip | Wan-Yu Lee, Jui Hsieh Lai, Tien-Yu Huang, Ying-Hao Kuo, Kuo-Chung Yee | 2015-08-04 |
| 9036956 | Method of fabricating a polymer waveguide | Wan-Yu Lee, Hai-Ching Chen, Tien-I Bao | 2015-05-19 |