Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12294002 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Heh-Chang Huang +8 more | 2025-05-06 |
| 12015023 | Integrated circuit package and method of forming same | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Heh-Chang Huang +8 more | 2024-06-18 |
| 11150404 | Photonic package and method forming same | Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen | 2021-10-19 |
| 11101260 | Method of forming a dummy die of an integrated circuit having an embedded annular structure | Shang-Yun Hou, Sung-Hui Huang, Kuan-Yu Huang, Hsien-Pin Hu, Heh-Chang Huang +8 more | 2021-08-24 |
| 10872871 | Chip package structure with dummy bump and method for forming the same | Sung-Hui Huang, Kuan-Yu Huang, Shang-Yun Hou, Heh-Chang Huang, Shu-Chia Hsu +2 more | 2020-12-22 |
| 10459159 | Photonic package and method forming same | Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen | 2019-10-29 |
| 10267988 | Photonic package and method forming same | Sung-Hui Huang, Jui Hsieh Lai, Tien-Yu Huang, Wen-Cheng Chen | 2019-04-23 |