Issued Patents All Time
Showing 1–25 of 51 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431426 | Semiconductor interconnection structures comprising a resistor device and methods of forming the same | Kai-Fang Cheng, Cherng-Shiaw Tsai, Ming-Hsien Lin, Hsiao-Kang Chang | 2025-09-30 |
| 12431386 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2025-09-30 |
| 12412804 | Semiconductor structure with improved heat dissipation | Shau-Lin Shue, Shao-Kuan Lee, Hsiao-Kang Chang, Cherng-Shiaw Tsai, Kai-Fang Cheng +6 more | 2025-09-09 |
| 12412780 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Shao-Kuan Lee, Ting-Ya Lo, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2025-09-09 |
| 12381143 | Self-align via structure by selective deposition | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2025-08-05 |
| 12381113 | Semiconductor device structure having air gap and methods of forming the same | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2025-08-05 |
| 12308286 | Interconnect structures including air gaps | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2025-05-20 |
| 12278143 | Method of providing a workpiece including low resistance interconnect low-resistance interconnect | Hsin-Yen Huang, Shao-Kuan Lee, Hsiang-Wei Liu, Tai-I Yang, Chia-Tien Wu +2 more | 2025-04-15 |
| 12272597 | Semiconductor interconnection structures and methods of forming the same | Hsiao-Kang Chang, Hsin-Yen Huang, Cherng-Shiaw Tsai, Shao-Kuan Lee, Shau-Lin Shue | 2025-04-08 |
| 12249555 | Semiconductor device package including a thermal conductive layer and methods of forming the same | Cherng-Shiaw Tsai, Shao-Kuan Lee, Hsiao-Kang Chang, Hsin-Yen Huang, Shau-Lin Shue | 2025-03-11 |
| 12230537 | Semiconductor device structure having air gap and methods of forming the same | Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2025-02-18 |
| 12176246 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2024-12-24 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Ting-Ya Lo, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2024-12-10 |
| 12132000 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Cherng-Shiaw Tsai, Kuang-Wei YANG, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2024-10-29 |
| 12094764 | Interconnect structure and methods of forming the same | Hsiao-Kang Chang, Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +3 more | 2024-09-17 |
| 12094815 | Semiconductor structure having dielectric-on-dielectric structure and method for forming the semiconductor structure | Shao-Kuan Lee, Hsin-Yen Huang, Hsiao-Kang Chang, Shau-Lin Shue | 2024-09-17 |
| 12074060 | Semiconductor device structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2024-08-27 |
| 12068248 | Semiconductor interconnection structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2024-08-20 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Ting-Ya Lo, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2024-08-13 |
| 12033889 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2024-07-09 |
| 12009301 | Interconnect structure | Shao-Kuan Lee, Hsin-Yen Huang, Hai-Ching Chen, Shau-Lin Shue | 2024-06-11 |
| 12009202 | Using a self-assembly layer to facilitate selective formation of an etching stop layer | Shao-Kuan Lee, Hsin-Yen Huang, Yung-Hsu Wu, Hai-Ching Chen, Shau-Lin Shue | 2024-06-11 |
| 12002750 | Interconnect structure | Hsin-Yen Huang, Shao-Kuan Lee, Hai-Ching Chen, Shau-Lin Shue | 2024-06-04 |
| 12002749 | Barrier and air-gap scheme for high performance interconnects | Hsin-Yen Huang, Ting-Ya Lo, Shao-Kuan Lee, Chi-Lin Teng, Shau-Lin Shue +1 more | 2024-06-04 |
| 11990400 | Capping layer overlying dielectric structure to increase reliability | Ting-Ya Lo, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue +1 more | 2024-05-21 |