HL

Hsiang-Wei Liu

TSMC: 46 patents #715 of 12,232Top 6%
GU Global Unichip: 3 patents #51 of 210Top 25%
QC Quanta Computer: 2 patents #439 of 1,295Top 35%
Foxconn: 1 patents #3,106 of 5,504Top 60%
Overall (All Time): #55,530 of 4,157,543Top 2%
49
Patents All Time

Issued Patents All Time

Showing 1–25 of 49 patents

Patent #TitleCo-InventorsDate
12380957 Memory device, layout, and method Andy Yang, Yao-Jen Yang 2025-08-05
12324149 Metal fuse structure by via landing Yao-Jen Yang, Meng-Sheng Chang 2025-06-03
12278143 Method of providing a workpiece including low resistance interconnect low-resistance interconnect Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Tai-I Yang, Chia-Tien Wu +2 more 2025-04-15
12058852 Semiconductor device and method of operating the same Wei-Chen Chu, Chia-Tien Wu 2024-08-06
12051646 Metal line structure and method Hsiang-Lun Kao, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more 2024-07-30
12002709 Interconnect structure and manufacturing method for the same Wei-Chen Chu, Chia-Tien Wu, Tai-I Yang 2024-06-04
11901295 Dielectric film for semiconductor fabrication Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang +1 more 2024-02-13
11860550 Multi-metal fill with self-aligned patterning and dielectric with voids Tai-I Yang, Wei-Chen Chu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu 2024-01-02
11769695 Semiconductor structure including low-resistance interconnect and integrated circuit device having the same Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Tai-I Yang, Chia-Tien Wu +2 more 2023-09-26
11729969 Semiconductor device and method of operating the same Wei-Chen Chu, Chia-Tien Wu 2023-08-15
11658032 Semiconductor epitaxy bordering isolation structure Wen-Chin Chen, Cheng-Yi Wu, Yu-Hung Cheng, Ren-Hua Guo, Chin-Szu Lee 2023-05-23
11448556 Temperature sensing device and temperature sensing method Ting Wang 2022-09-20
11422475 Multi-metal fill with self-aligned patterning and dielectric with voids Tai-I Yang, Wei-Chen Chu, Shau-Lin Shue, Li-Lin Su, Yung-Hsu Wu 2022-08-23
11302570 Interconnect structure and method for forming the same 2022-04-12
11296027 Dielectric film for semiconductor fabrication Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang +1 more 2022-04-05
11152306 Dielectric film for semiconductor fabrication Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang +1 more 2021-10-19
11107725 Interconnect structure and manufacturing method for the same Wei-Chen Chu, Chia-Tien Wu, Tai-I Yang 2021-08-31
11101216 Metal line structure and method Hsiang-Lun Kao, Tai-I Yang, Jian-Hua Chen, Yu-Chieh Liao, Yung-Chih Wang +1 more 2021-08-24
10957540 Semiconductor epitaxy bordering isolation structure Wen-Chin Chen, Cheng-Yi Wu, Yu-Hung Cheng, Ren-Hua Guo, Chin-Szu Lee 2021-03-23
10957580 Metal routing with flexible space formed using self-aligned spacer patterning Chia-Tien Wu, Wei-Chen Chu 2021-03-23
10930551 Methods for fabricating a low-resistance interconnect Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Tai-I Yang, Chia-Tien Wu +2 more 2021-02-23
10818597 Hybrid copper structure for advance interconnect usage Tai-I Yang, Cheng-Chi Chuang, Tien-Lu Lin 2020-10-27
10784151 Interconnect structure and manufacturing method for the same Wei-Chen Chu, Chia-Tien Wu, Tai-I Yang 2020-09-22
10734275 Metal routing with flexible space formed using self-aligned spacer patterning Chia-Tien Wu, Wei-Chen Chu 2020-08-04
10658296 Dielectric film for semiconductor fabrication Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang +1 more 2020-05-19