Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12062611 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Yung-Hsu Wu, Hsin-Ping Chen, Cheng-Chi Chuang | 2024-08-13 |
| 11860550 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Yung-Hsu Wu | 2024-01-02 |
| 11422475 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Yung-Hsu Wu | 2022-08-23 |
| 11251131 | Copper contact plugs with barrier layers | Ching-Hua Hsieh, Huang-Ming Chen, Hsueh Wen Tsau | 2022-02-15 |
| 11244898 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Yung-Hsu Wu, Hsin-Ping Chen, Cheng-Chi Chuang | 2022-02-08 |
| 11127680 | Semiconductor device and manufacturing method thereof | Shih-Kang Fu, Hsien-Chang Wu, Ming-Han Lee, Shau-Lin Shue | 2021-09-21 |
| 11088020 | Structure and formation method of interconnection structure of semiconductor device | Tai-I Yang, Wei-Chen Chu, Shin-Yi Yang, Cheng-Chi Chuang, Hsin-Ping Chen | 2021-08-10 |
| 10700010 | Copper contact plugs with barrier layers | Ching-Hua Hsieh, Huang-Ming Chen, Hsueh Wen Tsau | 2020-06-30 |
| 10534273 | Multi-metal fill with self-aligned patterning and dielectric with voids | Tai-I Yang, Wei-Chen Chu, Hsiang-Wei Liu, Shau-Lin Shue, Yung-Hsu Wu | 2020-01-14 |
| 9935006 | Trench liner for removing impurities in a non-copper trench | Hsien-Chang Wu | 2018-04-03 |
| 9721894 | Semiconductor device and manufacturing method thereof | Shih-Kang Fu, Hsien-Chang Wu, Ming-Han Lee, Shau-Lin Shue | 2017-08-01 |
| 9614052 | Copper contact plugs with barrier layers | Ching-Hua Hsieh, Huang-Ming Chen, Hsueh Wen Tsau | 2017-04-04 |
| 9589897 | Trench liner for removing impurities in a non-copper trench | Hsien-Chang Wu | 2017-03-07 |
| 9530737 | Semiconductor device and manufacturing method thereof | Shih-Kang Fu, Hsien-Chang Wu, Ming-Han Lee, Shau-Lin Shue | 2016-12-27 |
| 9136206 | Copper contact plugs with barrier layers | Ching-Hua Hsieh, Huang-Ming Chen, Hsueh Wen Tsau | 2015-09-15 |
| 8252690 | In situ Cu seed layer formation for improving sidewall coverage | Cheng-Lin Huang, Shing-Chyang Pan, Ching-Hua Hsieh | 2012-08-28 |
| 8034709 | Method for forming composite barrier layer | Cheng-Lin Huang, Ching-Hua Hsieh, Hsien-Ming Lee, Shing-Chyang Pan, Chao-Hsien Peng +3 more | 2011-10-11 |
| 7704886 | Multi-step Cu seed layer formation for improving sidewall coverage | Shing-Chyang Pan, Cheng-Lin Huang, Ching-Hua Hsieh | 2010-04-27 |
| 7453149 | Composite barrier layer | Cheng-Lin Huang, Ching-Hua Hsieh, Hsien-Ming Lee, Shing-Chyang Pan, Chao-Hsien Peng +3 more | 2008-11-18 |
| 7253501 | High performance metallization cap layer | Hsien-Ming Lee, Jing-Cheng Lin, Shing-Chyang Pan, Ching-Hua Hsieh, Chao-Hsien Peng +2 more | 2007-08-07 |