Issued Patents All Time
Showing 1–25 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412804 | Semiconductor structure with improved heat dissipation | Cheng-Chin Lee, Shau-Lin Shue, Shao-Kuan Lee, Hsiao-Kang Chang, Cherng-Shiaw Tsai +6 more | 2025-09-09 |
| 12230534 | Semiconductor device and method of manufacture | Tai-I Yang, Wei-Chen Chu, Yung-Chih Wang, Chia-Tien Wu, Shau-Lin Shue | 2025-02-18 |
| 12183671 | Hybrid metal line structure | Pokuan Ho, Chia-Tien Wu, Wei-Chen Chu | 2024-12-31 |
| 12136567 | Fully self-aligned interconnect structure | Shau-Lin Shue, Min Cao | 2024-11-05 |
| 12094816 | Semiconductor structure having deep metal line and method for forming the semiconductor structure | Wei-Chen Chu, Chia-Tien Wu, Chia-Wei Su, Yu-Chieh Liao, Chia-Chen Lee +1 more | 2024-09-17 |
| 12094946 | Gate all around device | Yung-Chih Wang, Yu-Chieh Liao, Tai-I Yang | 2024-09-17 |
| 12080593 | Barrier-less structures | Ming-Han Lee, Shin-Yi Yang, Yung-Hsu Wu, Chia-Tien Wu, Shau-Lin Shue +1 more | 2024-09-03 |
| 12062611 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Li-Lin Su, Yung-Hsu Wu, Cheng-Chi Chuang | 2024-08-13 |
| 11984359 | Semiconductor device with spacers for self aligned vias | Pokuan Ho, Chia-Tien Wu | 2024-05-14 |
| 11923306 | Semiconductor structure having air gaps and method for manufacturing the same | Chia-Wei Su, Chia-Tien Wu, Shau-Lin Shue | 2024-03-05 |
| 11848190 | Barrier-less structures | Yung-Hsu Wu, Chia-Tien Wu, Min Cao, Ming-Han Lee, Shau-Lin Shue +1 more | 2023-12-19 |
| 11764106 | Semiconductor device and method of manufacture | Tai-I Yang, Wei-Chen Chu, Yung-Chih Wang, Chia-Tien Wu, Shau-Lin Shue | 2023-09-19 |
| 11682618 | Hybrid metal line structure | Pokuan Ho, Chia-Tien Wu, Wei-Chen Chu | 2023-06-20 |
| 11640924 | Structure and method for interconnection with self-alignment | Tai-I Yang, Yu-Chieh Liao, Chia-Tien Wu, Hai-Ching Chen, Shau-Lin Shue | 2023-05-02 |
| 11361994 | Fully self-aligned interconnect structure | Shau-Lin Shue, Min Cao | 2022-06-14 |
| 11302792 | Fabrication of gate all around device | Yung-Chih Wang, Yu-Chieh Liao, Tai-I Yang | 2022-04-12 |
| 11264277 | Semiconductor device with spacers for self aligned vias | Pokuan Ho, Chia-Tien Wu | 2022-03-01 |
| 11257673 | Dual spacer metal patterning | Yu-Chieh Liao, Cheng-Chi Chuang, Chia-Tien Wu, Tai-I Yang | 2022-02-22 |
| 11244898 | Integrated circuit interconnect structures with air gaps | Tai-I Yang, Li-Lin Su, Yung-Hsu Wu, Cheng-Chi Chuang | 2022-02-08 |
| 11201106 | Semiconductor device with conductors embedded in a substrate | Ming-Han Lee, Shau-Lin Shue | 2021-12-14 |
| 11183422 | Semiconductor structure and method for manufacturing the same | Tai-I Yang, Wei-Chen Chu, Chih Wei Lu, Chung-Ju Lee | 2021-11-23 |
| 11167984 | Nano-electromechanical system (NEMS) device structure and method for forming the same | Carlos H. Diaz, Ken-Ichi Goto, Shau-Lin Shue, Tai-I Yang | 2021-11-09 |
| 11088020 | Structure and formation method of interconnection structure of semiconductor device | Tai-I Yang, Wei-Chen Chu, Li-Lin Su, Shin-Yi Yang, Cheng-Chi Chuang | 2021-08-10 |
| 11004740 | Structure and method for interconnection with self-alignment | Tai-I Yang, Yu-Chieh Liao, Chia-Tien Wu, Hai-Ching Chen, Shau-Lin Shue | 2021-05-11 |
| 10991618 | Semiconductor device and method of manufacture | Tai-I Yang, Wei-Chen Chu, Yung-Chih Wang, Chia-Tien Wu, Shau-Lin Shue | 2021-04-27 |