Issued Patents All Time
Showing 1–24 of 24 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431386 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2025-09-30 |
| 12412780 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Shao-Kuan Lee, Cheng-Chin Lee, Chi-Lin Teng, Hsiaokang CHANG +1 more | 2025-09-09 |
| 12381113 | Semiconductor device structure having air gap and methods of forming the same | Cheng-Chin Lee, Shao-Kuan Lee, Chi-Lin Teng, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2025-08-05 |
| 12230537 | Semiconductor device structure having air gap and methods of forming the same | Cheng-Chin Lee, Shao-Kuan Lee, Chi-Lin Teng, Hsin-Yen Huang, Hsiaokang CHANG +1 more | 2025-02-18 |
| 12176246 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2024-12-24 |
| 12165945 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Cheng-Chin Lee, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2024-12-10 |
| 12094764 | Interconnect structure and methods of forming the same | Cheng-Chin Lee, Hsiao-Kang Chang, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee +3 more | 2024-09-17 |
| 12068193 | Semiconductor device structure with interconnect structure having air gap | Hsin-Yen Huang, Shao-Kuan Lee, Chi-Lin Teng, Shau-Lin Shue, Hsiao-Kang Chang | 2024-08-20 |
| 12068248 | Semiconductor interconnection structure and methods of forming the same | Hsin-Yen Huang, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2024-08-20 |
| 12062572 | Semiconductor device having metallization layer with low capacitance and method for manufacturing the same | Cheng-Chin Lee, Chi-Lin Teng, Cherng-Shiaw Tsai, Shao-Kuan Lee, Kuang-Wei YANG +4 more | 2024-08-13 |
| 12033889 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2024-07-09 |
| 12027606 | Semiconductor devices with air gate spacer and air gate cap | Cheng-Chi Chuang, Lin-Yu Huang, Chia-Hao Chang, Yu-Ming Lin, Chi-Lin Teng +2 more | 2024-07-02 |
| 12002749 | Barrier and air-gap scheme for high performance interconnects | Hsin-Yen Huang, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue +1 more | 2024-06-04 |
| 11990400 | Capping layer overlying dielectric structure to increase reliability | Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2024-05-21 |
| 11923243 | Semiconductor structure having air gaps and method for manufacturing the same | Hsin-Yen Huang, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Shau-Lin Shue +1 more | 2024-03-05 |
| 11854963 | Semiconductor interconnection structure and methods of forming the same | Shao-Kuan Lee, Kuang-Wei YANG, Cherng-Shiaw Tsai, Cheng-Chin Lee, Chi-Lin Teng +3 more | 2023-12-26 |
| 11848198 | Method for manufacturing semiconductor device having low-k carbon-containing dielectric layer | Kai-Fang Cheng, Hsiao-Kang Chang | 2023-12-19 |
| 11810815 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2023-11-07 |
| 11658092 | Thermal interconnect structure for thermal management of electrical interconnect structure | Shao-Kuan Lee, Cherng-Shiaw Tsai, Cheng-Chin Lee, Chi-Lin Teng, Kai-Fang Cheng +3 more | 2023-05-23 |
| 11557511 | Semiconductor device structure and methods of forming the same | Hsin-Yen Huang, Shao-Kuan Lee, Chi-Lin Teng, Cheng-Chin Lee, Hsiaokang CHANG +1 more | 2023-01-17 |
| 11538749 | Interconnect structure | Shao-Kuan Lee, Hsin-Yen Huang, Cheng-Chin Lee, Kuang-Wei YANG, Chi-Lin Teng +2 more | 2022-12-27 |
| 11355430 | Capping layer overlying dielectric structure to increase reliability | Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2022-06-07 |
| 11322395 | Dielectric capping structure overlying a conductive structure to increase stability | Hsin-Yen Huang, Chi-Lin Teng, Hai-Ching Chen, Shau-Lin Shue, Shao-Kuan Lee +1 more | 2022-05-03 |
| 11302798 | Semiconductor devices with air gate spacer and air gate cap | Cheng-Chi Chuang, Lin-Yu Huang, Chia-Hao Chang, Yu-Ming Lin, Chi-Lin Teng +2 more | 2022-04-12 |