Issued Patents All Time
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11532552 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Hai-Ching Chen, Shau-Lin Shue, Tien-I Bao | 2022-12-20 |
| 11049811 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Kai-Fang Cheng, Hsin-Yen Huang, Hai-Ching Chen, Tien-I Bao | 2021-06-29 |
| 10867913 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Hai-Ching Chen, Shau-Lin Shue, Tien-I Bao | 2020-12-15 |
| 10163797 | Forming interlayer dielectric material by spin-on metal oxide deposition | Chi-Lin Teng, Kai-Fang Cheng, Hsin-Yen Huang, Hai-Ching Chen, Tien-I Bao | 2018-12-25 |
| 10090245 | Semiconductor device structure | Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Tien-I Bao | 2018-10-02 |
| 9922927 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Hai-Ching Chen, Shau-Lin Shue, Tien-I Bao | 2018-03-20 |
| 9818690 | Self-aligned interconnection structure and method | Chi-Lin Teng, Kai-Fang Cheng, Hsin-Yen Huang, Hai-Ching Chen, Tien-I Bao +1 more | 2017-11-14 |
| 9799603 | Semiconductor device structure and method for forming the same | Kai-Fang Cheng, Chi-Lin Teng, Hai-Ching Chen, Hsin-Yen Huang, Tien-I Bao | 2017-10-24 |
| 9659864 | Method and apparatus for forming self-aligned via with selectively deposited etching stop layer | Yung-Hsu Wu, Hai-Ching Chen, Shau-Lin Shue, Tien-I Bao | 2017-05-23 |