{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Fin cut and fin trim isolation for advanced integrated circuit structure fabrication", "item": "https://www.patentleaderboard.com/patent/10460993"}]}
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Home › Fin cut and fin trim isolation for advanced integrated circuit structure fabrication

Fin cut and fin trim isolation for advanced integrated circuit structure fabrication

US Patent 10460993 · Granted Oct 29, 2019

Estimated economic value: $25,165,000 ⓘ

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