Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12402331 | Decoupling capacitors based on dummy through-silicon-via plates | — | 2025-08-26 |
| 12356552 | Capacitor formed with coupled dies | — | 2025-07-08 |
| 12237388 | Transistor arrangements with stacked trench contacts and gate straps | Andy Wei, Guillaume Bouche, Hyuk-Ju Ryu, Charles H. Wallace, Mohit K. HARAN | 2025-02-25 |
| 12094822 | Buried power rails with self-aligned vias to trench contacts | Guillaume Bouche, Andy Wei | 2024-09-17 |
| 11923150 | Decoupling capacitors based on dummy through-silicon-vias | — | 2024-03-05 |
| 11222869 | Dummy TSV to improve process uniformity and heat dissipation | — | 2022-01-11 |
| 10396070 | Fin-shaped field effect transistor and capacitor structures | Shom Ponoth, Akira Ito | 2019-08-27 |
| 10181454 | Dummy TSV to improve process uniformity and heat dissipation | — | 2019-01-15 |
| 9941271 | Fin-shaped field effect transistor and capacitor structures | Shom Ponoth, Akira Ito | 2018-04-10 |
| 9337188 | Metal-insulator-metal capacitor structure | Shom Ponoth, Guang-Jye Shiau, Akira Ito | 2016-05-10 |
| 9209202 | Enabling bulk FINFET-based devices for FINFET technology with dielectric isolation | Shom Ponoth | 2015-12-08 |
| 9165936 | Dummy end-gate based anti-fuse device for finFET technologies | Shom Ponoth, Akira Ito | 2015-10-20 |