Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7180180 | Stacked device underfill and a method of fabrication | Grant Kloster, Shriram Ramanathan, Patrick Morrow | 2007-02-20 |
| 7169715 | Forming a dielectric layer using porogens | Andrew Ott, Grant Kloster, Robert Meagley | 2007-01-30 |
| 7157755 | Polymer sacrificial light absorbing structure and method | — | 2007-01-02 |
| 7138158 | Forming a dielectric layer using a hydrocarbon-containing precursor | Robert Meagley, Andrew Ott, Grant Kloster, Michael L. McSwiney, Bob Leet | 2006-11-21 |
| 7125582 | Low-temperature silicon nitride deposition | Michael L. McSwiney | 2006-10-24 |
| 7101798 | Method to modulate etch rate in SLAM | Robert Meagley, Kevin P. O'Brien | 2006-09-05 |
| 7071091 | Method of forming air gaps in a dielectric material using a sacrificial film | James S. Clarke | 2006-07-04 |
| 7071125 | Precursors for film formation | Michael L. McSwiney, Huey-Chiang Liou, Robert Leet, Robert Meagley | 2006-07-04 |
| 7034399 | Forming a porous dielectric layer | Grant Kloster, Kevin P. O'Brien, Justin K. Brask, Donald Bruner | 2006-04-25 |
| 7029723 | Forming chemical vapor depositable low dielectric constant layers | Tian-An Chen, Robert Meagley, Kevin P. O'Brien, James M. Powers | 2006-04-18 |
| 7030040 | Selectively growing a polymeric material on a semiconductor substrate | Grant Kloster | 2006-04-18 |
| 7018920 | Composite sacrificial material | Robert Meagley | 2006-03-28 |
| 7018918 | Method of forming a selectively converted inter-layer dielectric using a porogen material | Grant Kloster, Kevin P. O'Brien, Jihperng Leu, David H. Gracias, Lee Rockford +2 more | 2006-03-28 |
| 6991893 | Controlling resist profiles through substrate modification | Robert Meagley, Michael J. Leeson | 2006-01-31 |
| 6946384 | Stacked device underfill and a method of fabrication | Grant Kloster, Shriram Ramanathan, Patrick Morrow | 2005-09-20 |
| 6924222 | Formation of interconnect structures by removing sacrificial material with supercritical carbon dioxide | Jihperng Leu | 2005-08-02 |
| 6908717 | Positive photosensitive resin composition, process for its preparation, and semiconductor devices | Takashi Hirano, Shusaku Okaaki, Robert Meagley | 2005-06-21 |
| 6893985 | UV-activated dielectric layer | — | 2005-05-17 |
| 6876017 | Polymer sacrificial light absorbing structure and method | — | 2005-04-05 |
| 6867473 | Plating a conductive material on a dielectric material | Grant Kloster, Steven W. Johnston | 2005-03-15 |
| 6858528 | Composite sacrificial material | Robert Meagley | 2005-02-22 |
| 6737365 | Forming a porous dielectric layer | Grant Kloster, Kevin P. O'Brien, Justin K. Brask, Donald Bruner | 2004-05-18 |
| 6682989 | Plating a conductive material on a dielectric material | Grant Kloster, Steven W. Johnston | 2004-01-27 |
| 6566280 | Forming polymer features on a substrate | Robert Meagley | 2003-05-20 |
| 5730601 | Method and material for use with dental composites for improving conversion of monomers to polymers and reducing volume shrinkage | Christopher N. Bowman, Kristi Anseth, Anandkumar R. Kannurpatti | 1998-03-24 |