Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Mainboard assembly including a package overlying a die directly attached to the mainboard

Mainboard assembly including a package overlying a die directly attached to the mainboard

US Patent 10555417 · Granted Feb 4, 2020

Estimated economic value: $21,361,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Liquid cooling system leak detection improvements2025
Method for manufacturing a compressor impeller for a turbomachine2025
Stacked-chip packages in package-on-package apparatus, methods of assembling sam2022
Lug loader2019
Mainboard assembly including a package overlying a die directly attached to the 2019
Mainboard assembly including a package overlying a die directly attached to the 2019
Mainboard assembly including a package overlying a die directly attached to the 2019
Mainboard assembly including a package overlying a die directly attached to the 2019
Mainboard assembly including a package overlying a die directly attached to the 2019
Mainboard assembly including a package overlying a die directly attached to the 2019
Stacked-chip packages in package-on-package apparatus, methods of assembling sam2019
Lug loader2018