Issued Patents All Time
Showing 26–41 of 41 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9177911 | Package substrates with multiple dice | Nicholas Holmberg | 2015-11-03 |
| 9159690 | Tall solders for through-mold interconnect | Chia-Pin Chiu, Xiaorong Xiong, Linda Zhang, Charles A. Gealer | 2015-10-13 |
| 9049807 | Processes of making pad-less interconnect for electrical coreless substrate | Javier Soto, Charan Gurumurthy, Debendra Mallik | 2015-06-02 |
| 8987918 | Interconnect structures with polymer core | Sandeep Razdan, Edward R. Prack, Sairam Agraharam, Robert L. Sankman, Shan Zhong | 2015-03-24 |
| 8742597 | Package substrates with multiple dice | Nicholas Holmberg | 2014-06-03 |
| 8674519 | Microelectronic package and method of manufacturing same | Leonel Arana, Edward R. Prack | 2014-03-18 |
| 8513792 | Package-on-package interconnect stiffener | Sanka Ganesan, Yosuke Kanaoka, Ram Viswanath, Rajasekaran Swaminathan, Leonel Arana +2 more | 2013-08-20 |
| 7818878 | Integrated circuit device mounting with folded substrate and interposer | Ronald Spreitzer, John Conner, Brian Taggart | 2010-10-26 |
| 7375978 | Method and apparatus for trace shielding and routing on a substrate | John Conner, Brian Taggart | 2008-05-20 |
| 7358444 | Folded substrate with interposer package for integrated circuit devices | Ronald Spreitzer, John Conner, Brian Taggart | 2008-04-15 |
| 7302756 | Bond finger on via substrate, process of making same, package made thereby, and method of assembling same | Brian Taggart, Ronald Spreitzer | 2007-12-04 |
| 7304373 | Power distribution within a folded flex package method and apparatus | Brian Taggart, Ronald Spreitzer | 2007-12-04 |
| 7250684 | Circular wire-bond pad, package made therewith, and method of assembling same | Brian Taggart, Hai Ding | 2007-07-31 |
| 7205649 | Ball grid array copper balancing | Hamid Ekhlassi | 2007-04-17 |
| 7190068 | Bottom heat spreader | Dale Hackitt, Brian Taggart | 2007-03-13 |
| 6794760 | Integrated circuit interconnect | Edward Jaeck, Ronald I. Spreitzer, Lesley Polka | 2004-09-21 |