Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9443801 | Method to reduce metal fuse thickness without extra mask | Fuchao Wang, Zhiyong Xie | 2016-09-13 |
| 9059174 | Method to reduce metal fuse thickness without extra mask | Fuchao Wang, Zhiyong Xie | 2015-06-16 |
| 7389013 | Method and system for vertical optical coupling on semiconductor substrate | Ming Fang, Larry R. Tullos | 2008-06-17 |
| 7250684 | Circular wire-bond pad, package made therewith, and method of assembling same | Robert M. Nickerson, Brian Taggart | 2007-07-31 |
| 6953925 | Microlens integration | Ming Fang, Fuchao Wang | 2005-10-11 |