Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 8890628 | Ultra slim RF package for ultrabooks and smart phones | Vijay K. Nair, Carlton Hanna | 2014-11-18 | $17,555,000 |
| 7638867 | Microelectronic package having solder-filled through-vias | Dingying Xu | 2009-12-29 | $18,144,000 |
| 7372133 | Microelectronic package having a stiffening element and method of making same | Saeed S. Shojaie, Brian Taggart | 2008-05-13 | $17,373,000 |
| 7190068 | Bottom heat spreader | Robert M. Nickerson, Brian Taggart | 2007-03-13 | $17,337,000 |
| 6972152 | Use of direct gold surface finish on a copper wire-bond substrate, methods of making same, and methods of testing same | Brian Taggert, Dilip Misra | 2005-12-06 | $17,814,000 |
| 5489805 | Slotted thermal dissipater for a semiconductor package | Behrooz Mehr | 1996-02-06 | $38,721,000 |