Issued Patents All Time
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11769713 | Lead frames having rounded corners and related packages and methods | — | 2023-09-26 |
| 11476208 | Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods | Fernando Chen, Emmanuel de los Santos, Alex Kungo | 2022-10-18 |
| 11430718 | Lead frames for semiconductor packages with increased reliability and related semiconductor device packages and methods | — | 2022-08-30 |
| 10741507 | Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods | Fernando Chen, Emmanuel de los Santos, Alex Kungo | 2020-08-11 |
| 7505248 | Controlled-resistance capacitors, and methods of assembling same | Juan Soto, Nicholas Holmberg, Kevin Lenio, Larry E. Mosley | 2009-03-17 |
| 6924970 | Capacitor method and apparatus | Juan Soto, Kevin Lenio, Nick Holmberg | 2005-08-02 |
| 6133134 | Ball grid array integrated circuit package | — | 2000-10-17 |
| 5936848 | Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias | Tony K. Lim, Agnes Seok-Tuan Lim, Michael Barrow | 1999-08-10 |
| 5530295 | Drop-in heat sink | — | 1996-06-25 |
| 5489805 | Slotted thermal dissipater for a semiconductor package | Dale Hackitt | 1996-02-06 |
| 5444909 | Method of making a drop-in heat sink | — | 1995-08-29 |