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Lead frames having rounded corners and related packages and methods |
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2022-08-30 |
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Grounding techniques for backside-biased semiconductor dice and related devices, systems and methods |
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Juan Soto, Nicholas Holmberg, Kevin Lenio, Larry E. Mosley |
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Capacitor method and apparatus |
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Ball grid array integrated circuit package |
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2000-10-17 |
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Slotted thermal dissipater for a semiconductor package |
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1995-08-29 |