Issued Patents All Time
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5936848 | Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias | Behrooz Mehr, Tony K. Lim, Michael Barrow | 1999-08-10 |