| 11750983 |
Microphone assembly with standoffs for die bonding |
Norman Dennis Talag |
2023-09-05 |
| 11696082 |
Insert molded or over molded insulating layers on enclosures for microphone assemblies |
Norman Dennis Talag, Lili Borna |
2023-07-04 |
| 11662236 |
Sensor package with ingress protection |
Norman Dennis Talag |
2023-05-30 |
| 10924867 |
Microphone package |
John B. Szczech, Joshua John Watson |
2021-02-16 |
| 10640371 |
Microelectromechanical system (MEMS) device packaging |
Norman Dennis Talag |
2020-05-05 |
| 10631099 |
Microphone package |
John B. Szczech, Joshua John Watson |
2020-04-21 |
| 10591326 |
Sensor package with ingress protection |
Norman Dennis Talag |
2020-03-17 |
| 10547955 |
Microphone package for fully encapsulated ASIC and wires |
John B. Szczech, Joshua John Watson |
2020-01-28 |
| 10291973 |
Sensor device with ingress protection |
Norman Dennis Talag |
2019-05-14 |
| 10227232 |
Microelectromechanical system (MEMS) device packaging |
Norman Dennis Talag |
2019-03-12 |
| 9883270 |
Microphone with coined area |
— |
2018-01-30 |
| 9402118 |
Housing and method to control solder creep on housing |
Kurt B. Friel |
2016-07-26 |
| 5936848 |
Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias |
Behrooz Mehr, Agnes Seok-Tuan Lim, Michael Barrow |
1999-08-10 |