Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11750983 | Microphone assembly with standoffs for die bonding | Norman Dennis Talag | 2023-09-05 |
| 11696082 | Insert molded or over molded insulating layers on enclosures for microphone assemblies | Norman Dennis Talag, Lili Borna | 2023-07-04 |
| 11662236 | Sensor package with ingress protection | Norman Dennis Talag | 2023-05-30 |
| 10924867 | Microphone package | John B. Szczech, Joshua John Watson | 2021-02-16 |
| 10640371 | Microelectromechanical system (MEMS) device packaging | Norman Dennis Talag | 2020-05-05 |
| 10631099 | Microphone package | John B. Szczech, Joshua John Watson | 2020-04-21 |
| 10591326 | Sensor package with ingress protection | Norman Dennis Talag | 2020-03-17 |
| 10547955 | Microphone package for fully encapsulated ASIC and wires | John B. Szczech, Joshua John Watson | 2020-01-28 |
| 10291973 | Sensor device with ingress protection | Norman Dennis Talag | 2019-05-14 |
| 10227232 | Microelectromechanical system (MEMS) device packaging | Norman Dennis Talag | 2019-03-12 |
| 9883270 | Microphone with coined area | — | 2018-01-30 |
| 9402118 | Housing and method to control solder creep on housing | Kurt B. Friel | 2016-07-26 |
| 5936848 | Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias | Behrooz Mehr, Agnes Seok-Tuan Lim, Michael Barrow | 1999-08-10 |