Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9399574 | MEMS package and a method for manufacturing the same | Peter V. Loeppert, Denise P. Czech, Lawrence A. Grunert, Qing Wang | 2016-07-26 |
| 9402118 | Housing and method to control solder creep on housing | Tony K. Lim | 2016-07-26 |
| 9301075 | MEMS microphone with out-gassing openings and method of manufacturing the same | John B. Szczech | 2016-03-29 |
| 8987030 | MEMS package and a method for manufacturing the same | Peter V. Loeppert, Denise P. Czech, Lawrence A. Grunert, Qing Wang | 2015-03-24 |
| 7257281 | Method for fabricating thick film alumina structures used in high frequency, low loss applications and a structure resulting therefrom | Leonard Wardzala, Gregory Ballard | 2007-08-14 |