Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9399574 | MEMS package and a method for manufacturing the same | Peter V. Loeppert, Denise P. Czech, Kurt B. Friel, Qing Wang | 2016-07-26 |
| 8987030 | MEMS package and a method for manufacturing the same | Peter V. Loeppert, Denise P. Czech, Kurt B. Friel, Qing Wang | 2015-03-24 |
| 8791531 | Package with a CMOS die positioned underneath a MEMS die | Peter V. Loeppert, David W. Giesecke, Anthony D. Minervini, Jeffrey Niew | 2014-07-29 |