| 11911128 |
Wireless neural recording devices and system with two stage RF and NIR power delivery and programming |
David Theodore Blaauw, Jamie Phillips, Cynthia Anne Chestek, Taekwang Jang, Hun-Seok Kim +6 more |
2024-02-27 |
|
| 9684293 |
Refrigerant relief valve monitoring system and method |
William E. Barrow, Elizabeth Barrow Moore |
2017-06-20 |
|
| 8847372 |
Exposed die overmolded flip chip package and fabrication method |
Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more |
2014-09-30 |
$14,313,000 |
| 8541260 |
Exposed die overmolded flip chip package and fabrication method |
Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more |
2013-09-24 |
$6,059,000 |
| 8476748 |
Exposed die overmolded flip chip package and fabrication method |
Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more |
2013-07-02 |
$6,391,000 |
| 8368194 |
Exposed die overmolded flip chip package |
Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more |
2013-02-05 |
$2,514,000 |
| 8207022 |
Exposed die overmolded flip chip package method |
Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more |
2012-06-26 |
$6,449,000 |
| 8109765 |
Intelligent tutoring feedback |
Valerie L. Beattie, Marilyn Jager Adams |
2012-02-07 |
$777,000 |
| 7898093 |
Exposed die overmolded flip chip package and fabrication method |
Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more |
2011-03-01 |
$6,749,000 |
| 7543377 |
Perimeter matrix ball grid array circuit package with a populated center |
— |
2009-06-09 |
$25,076,000 |
| 6747362 |
Perimeter matrix ball grid array circuit package with a populated center |
— |
2004-06-08 |
$20,315,000 |
| 6521845 |
Thermal spreading enhancements for motherboards using PBGAs |
— |
2003-02-18 |
$52,625,000 |
| 6498390 |
Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing |
— |
2002-12-24 |
$92,784,000 |
| 6420651 |
Integrated circuit package with bond wires at the corners of an integrated circuit |
— |
2002-07-16 |
$65,603,000 |
| 6297078 |
Integrated circuit package with bond wires at the corners of an integrated circuit |
— |
2001-10-02 |
$98,303,000 |
| 6255135 |
Quad flat pack integrated circuit package |
— |
2001-07-03 |
$161,128,000 |
| 6146921 |
Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink |
— |
2000-11-14 |
$197,588,000 |
| 6118182 |
Integrated circuit package with rectangular contact pads |
— |
2000-09-12 |
$304,851,000 |
| 6110762 |
Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package |
— |
2000-08-29 |
$206,201,000 |
| 5978224 |
Quad flat pack integrated circuit package |
— |
1999-11-02 |
$87,065,000 |
| 5949651 |
Quad flat pack integrated circuit package |
— |
1999-09-07 |
$115,425,000 |
| 5936848 |
Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias |
Behrooz Mehr, Tony K. Lim, Agnes Seok-Tuan Lim |
1999-08-10 |
$109,908,000 |
| 5917702 |
Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package |
— |
1999-06-29 |
$133,089,000 |
| 5898219 |
Custom corner attach heat sink design for a plastic ball grid array integrated circuit package |
— |
1999-04-27 |
$99,695,000 |
| 5894410 |
Perimeter matrix ball grid array circuit package with a populated center |
— |
1999-04-13 |
$127,378,000 |
