Issued Patents All Time
Showing 25 most recent of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11911128 | Wireless neural recording devices and system with two stage RF and NIR power delivery and programming | David Theodore Blaauw, Jamie Phillips, Cynthia Anne Chestek, Taekwang Jang, Hun-Seok Kim +6 more | 2024-02-27 |
| 9684293 | Refrigerant relief valve monitoring system and method | William E. Barrow, Elizabeth Barrow Moore | 2017-06-20 |
| 8847372 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2014-09-30 |
| 8541260 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2013-09-24 |
| 8476748 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2013-07-02 |
| 8368194 | Exposed die overmolded flip chip package | Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2013-02-05 |
| 8207022 | Exposed die overmolded flip chip package method | Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2012-06-26 |
| 8109765 | Intelligent tutoring feedback | Valerie L. Beattie, Marilyn Jager Adams | 2012-02-07 |
| 7898093 | Exposed die overmolded flip chip package and fabrication method | Robert Francis Darveaux, Miguel A. Jimarez, Jae Dong Kim, Dae Keun Park, Ki Wook Lee +1 more | 2011-03-01 |
| 7543377 | Perimeter matrix ball grid array circuit package with a populated center | — | 2009-06-09 |
| 6747362 | Perimeter matrix ball grid array circuit package with a populated center | — | 2004-06-08 |
| 6521845 | Thermal spreading enhancements for motherboards using PBGAs | — | 2003-02-18 |
| 6498390 | Integrated circuit package that includes a thermally conductive tape which attaches a thermal element to a plastic housing | — | 2002-12-24 |
| 6420651 | Integrated circuit package with bond wires at the corners of an integrated circuit | — | 2002-07-16 |
| 6297078 | Integrated circuit package with bond wires at the corners of an integrated circuit | — | 2001-10-02 |
| 6255135 | Quad flat pack integrated circuit package | — | 2001-07-03 |
| 6146921 | Cavity mold cap BGA package with post mold thermally conductive epoxy attach heat sink | — | 2000-11-14 |
| 6118182 | Integrated circuit package with rectangular contact pads | — | 2000-09-12 |
| 6110762 | Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package | — | 2000-08-29 |
| 5978224 | Quad flat pack integrated circuit package | — | 1999-11-02 |
| 5949651 | Quad flat pack integrated circuit package | — | 1999-09-07 |
| 5936848 | Electronics package that has a substrate with an array of hollow vias and solder balls that are eccentrically located on the vias | Behrooz Mehr, Tony K. Lim, Agnes Seok-Tuan Lim | 1999-08-10 |
| 5917702 | Corner heat sink which encloses an integrated circuit of a ball grid array integrated circuit package | — | 1999-06-29 |
| 5898219 | Custom corner attach heat sink design for a plastic ball grid array integrated circuit package | — | 1999-04-27 |
| 5894410 | Perimeter matrix ball grid array circuit package with a populated center | — | 1999-04-13 |