Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Exposed die overmolded flip chip package and fabrication method

Exposed die overmolded flip chip package and fabrication method

US Patent 8476748 · Granted Jul 2, 2013

Estimated economic value: $6,391,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Methods related to dual-sided module with land-grid array (LGA) footprint2025
Device, method, computer program, and computer readable-recording medium for rou2025
Electronic package and method for manufacturing an electronic package2025
Semiconductor device using EMC wafer support system and fabricating method there2025
Image processing apparatus, image processing method, computer program and comput2025
Closed-cavity printed circuit board2025
Application of conductive via or trench for intra module EMI shielding2025
Semiconductor device and manufacturing method thereof2025
Electronic device package and fabricating method thereof2025
Fine pitch copper pillar package and method2025
Semiconductor device with a semiconductor die embedded between an extended subst2024
Packaged module with ball grid array and grounding pins for signal isolation, me2024