Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package

Method of manufacturing a custom corner attach heat sink design for a plastic ball grid array integrated circuit package

US Patent 6110762 · Granted Aug 29, 2000

Estimated economic value: $206,201,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Wireless neural recording devices and system with two stage RF and NIR power del2024
Refrigerant relief valve monitoring system and method2017
Exposed die overmolded flip chip package and fabrication method2014
Exposed die overmolded flip chip package and fabrication method2013
Exposed die overmolded flip chip package and fabrication method2013
Exposed die overmolded flip chip package2013
Exposed die overmolded flip chip package method2012
Intelligent tutoring feedback2012
Exposed die overmolded flip chip package and fabrication method2011
Perimeter matrix ball grid array circuit package with a populated center2009
Perimeter matrix ball grid array circuit package with a populated center2004
Thermal spreading enhancements for motherboards using PBGAs2003