Issued Patents All Time
Showing 26–36 of 36 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5889655 | Integrated circuit package substrate with stepped solder mask openings | — | 1999-03-30 |
| 5880529 | Silicon metal-pillar conductors under stagger bond pads | — | 1999-03-09 |
| 5875102 | Eclipse via in pad structure | — | 1999-02-23 |
| 5867367 | Quad flat pack integrated circuit package | — | 1999-02-02 |
| 5812379 | Small diameter ball grid array pad size for improved motherboard routing | — | 1998-09-22 |
| 5801450 | Variable pitch stagger die for optimal density | — | 1998-09-01 |
| 5796589 | Ball grid array integrated circuit package that has vias located within the solder pads of a package | — | 1998-08-18 |
| 5706178 | Ball grid array integrated circuit package that has vias located within the solder pads of a package | — | 1998-01-06 |
| 4560962 | Multilayered printed circuit board with controlled 100 ohm impedance | — | 1985-12-24 |
| 4553111 | Printed circuit board maximizing areas for component utilization | — | 1985-11-12 |
| 4507931 | Bottling plant cooling systems | Billy E. Barrow, William E. Barrow | 1985-04-02 |