Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7818878 | Integrated circuit device mounting with folded substrate and interposer | Robert M. Nickerson, John Conner, Brian Taggart | 2010-10-26 |
| 7358444 | Folded substrate with interposer package for integrated circuit devices | Robert M. Nickerson, John Conner, Brian Taggart | 2008-04-15 |
| 7302756 | Bond finger on via substrate, process of making same, package made thereby, and method of assembling same | Brian Taggart, Robert M. Nickerson | 2007-12-04 |
| 7304373 | Power distribution within a folded flex package method and apparatus | Brian Taggart, Robert M. Nickerson | 2007-12-04 |