Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microelectronic component having molded regions with through-mold vias

Microelectronic component having molded regions with through-mold vias

US Patent 11640942 · Granted May 2, 2023

Estimated economic value: $21,235,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Flexible die to floor planning with bump pitch scale through glass core via pitc2025
Photonic interconnect and components in glass2025
Ultra-thin, hyper-density semiconductor packages2025
Systems and methods for cloud based root service application across multiple coo2025
Hybrid bonding technologies with thermal expansion compensation structures2025
Integrated MEMS resonator and method2025
Nested glass packaging architecture for hybrid electrical and optical communicat2025
Microelectronic assemblies including interconnects with different solder materia2025
Microelectronic assemblies including interconnects with different solder materia2025
Ultra-thin, hyper-density semiconductor packages2025
Planar integrated circuit package interconnects2025
Pitch translation architecture for semiconductor package including embedded inte2025