| 12431424 |
Buried power rails integrated with decoupling capacitance |
Bernd Waidhas, Harald Gossner, Wolfgang Molzer, Georg Seidemann, Michael Langenbuch +3 more |
2025-09-30 |
|
| 12406925 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Andreas Wolter, Bernd Waidhas |
2025-09-02 |
|
| 12362241 |
Semiconductor structure and method for forming a semiconductor structure |
Richard Geiger, Klaus Herold, Harald Gossner, Martin Ostermayr, Georgios Panagopoulos +2 more |
2025-07-15 |
|
| 12362251 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Bernd Waidhas, Thomas Ort |
2025-07-15 |
|
| 12341096 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Andreas Wolter, Bernd Waidhas |
2025-06-24 |
|
| 12308335 |
Integrating and accessing passive components in wafer-level packages |
Gianni SIGNORINI, Veronica Sciriha |
2025-05-20 |
|
| 12125815 |
Assembly of 2XD module using high density interconnect bridges |
Bernd Waidhas, Andreas Wolter, Georg Seidemann |
2024-10-22 |
$18,859,000 |
| 12057364 |
Package formation methods including coupling a molded routing layer to an integrated routing layer |
Lizabeth Keser, Thomas Ort, Bernd Waidhas |
2024-08-06 |
$17,070,000 |
| 11990408 |
WLCSP reliability improvement for package edges including package shielding |
Jan Proschwitz |
2024-05-21 |
$18,840,000 |
| 11955395 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Bernd Waidhas, Thomas Ort |
2024-04-09 |
$27,197,000 |
| 11764187 |
Semiconductor packages, and methods for forming semiconductor packages |
Bernd Waidhas, Georg Seidemann, Andreas Wolter, Andreas Augustin, Sonja Koller +2 more |
2023-09-19 |
$20,015,000 |
| 11646288 |
Integrating and accessing passive components in wafer-level packages |
Gianni SIGNORINI, Veronica Sciriha |
2023-05-09 |
$19,706,000 |
| 11581287 |
Chip scale thin 3D die stacked package |
Robert L. Sankman, Sanka Ganesan, Bernd Waidhas, Lizabeth Keser |
2023-02-14 |
$12,790,000 |
| 11508637 |
Fan out package and methods |
Lizabeth Keser, Thomas Ort, Bernd Waidhas |
2022-11-22 |
$12,862,000 |
| 11469213 |
Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics |
Georg Seidemann, Klaus Reingruber, Bernd Waidhas, Andreas Wolter |
2022-10-11 |
$16,542,000 |
| 11404339 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Bernd Waidhas, Thomas Ort |
2022-08-02 |
$13,520,000 |
| 11374323 |
Patch antennas stitched to systems in packages and methods of assembling same |
Andreas Augustin, Sonja Koller, Bernd Waidhas, Georg Seidemann, Andreas Wolter +2 more |
2022-06-28 |
$15,065,000 |
| 11270941 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Andreas Wolter, Bernd Waidhas |
2022-03-08 |
$16,017,000 |
| 11211337 |
Face-up fan-out electronic package with passive components using a support |
Lizabeth Keser, Thomas Ort, Bernd Waidhas |
2021-12-28 |
$27,770,000 |
| 11177220 |
Vertical and lateral interconnects between dies |
Georg Seidemann, Andreas Wolter, Bernd Waidhas |
2021-11-16 |
$23,453,000 |
| 11127813 |
Semiconductor inductors |
Georg Seidemann, Bernd Waidhas, Andreas Wolter, Andreas Augustin |
2021-09-21 |
$30,488,000 |
| 11107763 |
Interconnect structure for stacked die in a microelectronic device |
Andreas Wolter, Georg Seidemann |
2021-08-31 |
$22,590,000 |
| 11018114 |
Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory |
Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more |
2021-05-25 |
|
| 10816742 |
Integrated circuit packages including an optical redistribution layer |
Georg Seidemann, Christian Geissler, Sven Albers, Marc Dittes, Klaus Reingruber +2 more |
2020-10-27 |
|
| 10756042 |
Multi-layer redistribution layer for wafer-level packaging |
— |
2020-08-25 |
|
