Issued Patents All Time
Showing 26–44 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727197 | Embedded-bridge substrate connectors and methods of assembling same | Bernd Waidhas, Georg Seidemann, Andreas Wolter, Stephan Stoeckl, Laurent Millou | 2020-07-28 |
| 10720393 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2020-07-21 |
| 10699980 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Bernd Waidhas, Thomas Ort | 2020-06-30 |
| 10665522 | Package including an integrated routing layer and a molded routing layer | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2020-05-26 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more | 2020-02-04 |
| 10546817 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2020-01-28 |
| 10522485 | Electrical device and a method for forming an electrical device | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more | 2019-12-31 |
| 10490527 | Vertical wire connections for integrated circuit package | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more | 2019-11-26 |
| 10431545 | Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same | Georg Seidemann, Bernd Waidhas, Andreas Wolter, Laurent Millou | 2019-10-01 |
| 10411000 | Microelectronic package with illuminated backside exterior | Marc Dittes, Sven Albers, Christian Geissler, Andreas Wolter, Klaus Reingruber +2 more | 2019-09-10 |
| 10403609 | System-in-package devices and methods for forming system-in-package devices | Christian Geissler, Sven Albers, Georg Seidemann, Andreas Wolter, Klaus Reingruber +1 more | 2019-09-03 |
| 10403580 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Ort, Bernd Waidhas | 2019-09-03 |
| 10403602 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Bernd Waidhas, Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter +2 more | 2019-09-03 |
| 10366968 | Interconnect structure for a microelectronic device | Klaus Reingruber, Andreas Wolter, Georg Seidemann, Bernd Waidhas | 2019-07-30 |
| 10209466 | Integrated circuit packages including an optical redistribution layer | Georg Seidemann, Christian Geissler, Sven Albers, Marc Dittes, Klaus Reingruber +2 more | 2019-02-19 |
| 10141265 | Bent-bridge semiconductive apparatus | Bernd Waidhas, Stephan Stoeckl, Andreas Wolter, Reinhard Mahnkopf, Georg Seidemann +1 more | 2018-11-27 |
| 10115668 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Bernd Waidhas +1 more | 2018-10-30 |
| 8471393 | Semiconductor component including a semiconductor chip and a passive component | Thorsten Meyer, Bernd Waidhas, Markus Brunnbauer, Grit Sommer | 2013-06-25 |
| 8076739 | Micromechanical component and method for producing a micromechanical component | Peter Schmollngruber, Hans Artmann | 2011-12-13 |