| 12439616 |
Integrated circuit package redistribution layers with metal-insulator-metal (MIM) capacitors |
David O'Sullivan, Georg Seidemann, Horst Baumeister |
2025-10-07 |
|
| 12431424 |
Buried power rails integrated with decoupling capacitance |
Harald Gossner, Wolfgang Molzer, Georg Seidemann, Michael Langenbuch, Martin Ostermayr +3 more |
2025-09-30 |
|
| 12406925 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Andreas Wolter |
2025-09-02 |
|
| 12394726 |
Method to implement wafer-level chip-scale packages with grounded conformal shield |
Gianni SIGNORINI, Georg Seidemann |
2025-08-19 |
|
| 12374625 |
Microelectronic assemblies having topside power delivery structures |
Carlton Hanna, Stephen L. Morein, Lizabeth Keser, Georg Seidemann |
2025-07-29 |
|
| 12362251 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2025-07-15 |
|
| 12341096 |
Bare-die smart bridge connected with copper pillars for system-in-package apparatus |
Georg Seidemann, Thomas Wagner, Andreas Wolter |
2025-06-24 |
|
| 12243856 |
Fan out packaging pop mechanical attach method |
David O'Sullivan, Georg Seidemann, Richard Patten |
2025-03-04 |
|
| 12243828 |
Microelectronic assemblies having topside power delivery structures |
Carlton Hanna, Stephen L. Morein, Lizabeth Keser, Georg Seidemann |
2025-03-04 |
|
| 12211796 |
Microelectronic assemblies having topside power delivery structures |
Carlton Hanna, Stephen L. Morein, Lizabeth Keser, Georg Seidemann |
2025-01-28 |
|
| 12191571 |
Antenna with graded dielectirc and method of making the same |
Saravana Maruthamuthu, Andreas Augustin, Georg Seidemann |
2025-01-07 |
|
| 12125815 |
Assembly of 2XD module using high density interconnect bridges |
Andreas Wolter, Georg Seidemann, Thomas Wagner |
2024-10-22 |
$18,859,000 |
| 12080655 |
Method to implement wafer-level chip-scale packages with grounded conformal shield |
Gianni SIGNORINI, Georg Seidemann |
2024-09-03 |
$14,017,000 |
| 12057411 |
Stress relief die implementation |
Stephan Stoeckl, Wolfgang Molzer, Georg Seidemann |
2024-08-06 |
$17,070,000 |
| 12057364 |
Package formation methods including coupling a molded routing layer to an integrated routing layer |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2024-08-06 |
$17,070,000 |
| 11955395 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2024-04-09 |
$27,197,000 |
| 11877403 |
Printed wiring-board islands for connecting chip packages and methods of assembling same |
Georg Seidemann, Sonja Koller |
2024-01-16 |
$42,805,000 |
| 11764187 |
Semiconductor packages, and methods for forming semiconductor packages |
Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin, Sonja Koller +2 more |
2023-09-19 |
$20,015,000 |
| 11735570 |
Fan out packaging pop mechanical attach method |
David O'Sullivan, Georg Seidemann, Richard Patten |
2023-08-22 |
$16,803,000 |
| 11581287 |
Chip scale thin 3D die stacked package |
Robert L. Sankman, Sanka Ganesan, Thomas Wagner, Lizabeth Keser |
2023-02-14 |
$12,790,000 |
| 11508637 |
Fan out package and methods |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2022-11-22 |
$12,862,000 |
| 11469213 |
Systems, methods, and apparatuses for implementing reduced height semiconductor packages for mobile electronics |
Georg Seidemann, Thomas Wagner, Klaus Reingruber, Andreas Wolter |
2022-10-11 |
$16,542,000 |
| 11456116 |
Magnetic coils in locally thinned silicon bridges and methods of assembling same |
Andreas Augustin, Sonja Koller, Reinhard Mahnkopf, Georg Seidemann |
2022-09-27 |
$23,391,000 |
| 11404339 |
Fan out package with integrated peripheral devices and methods |
Lizabeth Keser, Thomas Ort, Thomas Wagner |
2022-08-02 |
$13,520,000 |
| 11380616 |
Fan out package-on-package with adhesive die attach |
David O'Sullivan, Thomas J. Huber |
2022-07-05 |
|
