Issued Patents All Time
Showing 26–50 of 59 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11270941 | Bare-die smart bridge connected with copper pillars for system-in-package apparatus | Georg Seidemann, Thomas Wagner, Andreas Wolter | 2022-03-08 |
| 11211337 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2021-12-28 |
| 11177220 | Vertical and lateral interconnects between dies | Georg Seidemann, Andreas Wolter, Thomas Wagner | 2021-11-16 |
| 11145577 | Lead frame with angular deflections and wrapped printed wiring boards for system-in-package apparatus | Sonja Koller, Georg Seidemann, Reinhard Mahnkopf | 2021-10-12 |
| 11134573 | Printed wiring-board islands for connecting chip packages and methods of assembling same | Georg Seidemann, Sonja Koller | 2021-09-28 |
| 11127813 | Semiconductor inductors | Georg Seidemann, Thomas Wagner, Andreas Wolter, Andreas Augustin | 2021-09-21 |
| 11031699 | Antenna with graded dielectirc and method of making the same | Saravana Maruthamuthu, Andreas Augustin, Georg Seidemann | 2021-06-08 |
| 11018114 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter, Reinhard Mahnkopf +2 more | 2021-05-25 |
| 10867934 | Component magnetic shielding for microelectronic devices | Saravana Maruthamuthu, Thomas Ort, Andreas Wolter, Andreas Augustin, Veronica Sciriha | 2020-12-15 |
| 10727197 | Embedded-bridge substrate connectors and methods of assembling same | Georg Seidemann, Andreas Wolter, Thomas Wagner, Stephan Stoeckl, Laurent Millou | 2020-07-28 |
| 10720393 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2020-07-21 |
| 10699980 | Fan out package with integrated peripheral devices and methods | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2020-06-30 |
| 10665522 | Package including an integrated routing layer and a molded routing layer | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2020-05-26 |
| 10658201 | Carrier substrate for a semiconductor device and a method for forming a carrier substrate for a semiconductor device | Sonja Koller, Georg Seidemann | 2020-05-19 |
| 10629731 | Power mesh-on-die trace bumping | Sonja Koller, Georg Seidemann | 2020-04-21 |
| 10553538 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Thomas Wagner +1 more | 2020-02-04 |
| 10546817 | Face-up fan-out electronic package with passive components using a support | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2020-01-28 |
| 10431545 | Cross-connected multi-chip modules coupled by silicon bent-bridge interconnects and methods of assembling same | Georg Seidemann, Thomas Wagner, Andreas Wolter, Laurent Millou | 2019-10-01 |
| 10403602 | Monolithic silicon bridge stack including a hybrid baseband die supporting processors and memory | Georg Seidemann, Andreas Augustin, Laurent Millou, Andreas Wolter, Reinhard Mahnkopf +2 more | 2019-09-03 |
| 10403580 | Molded substrate package in fan-out wafer level package | Lizabeth Keser, Thomas Ort, Thomas Wagner | 2019-09-03 |
| 10394280 | Wearable electronic devices and components thereof | Thorsten Meyer, Dirk Plenkers, Hans-Joachim Barth, Yen Hsiang Chew, Kooi Chi Ooi +1 more | 2019-08-27 |
| 10366968 | Interconnect structure for a microelectronic device | Klaus Reingruber, Andreas Wolter, Georg Seidemann, Thomas Wagner | 2019-07-30 |
| 10263106 | Power mesh-on-die trace bumping | Sonja Koller, Georg Seidemann | 2019-04-16 |
| 10141265 | Bent-bridge semiconductive apparatus | Stephan Stoeckl, Andreas Wolter, Reinhard Mahnkopf, Georg Seidemann, Thomas Wagner +1 more | 2018-11-27 |
| 10115668 | Semiconductor package having a variable redistribution layer thickness | Klaus Reingruber, Sven Albers, Christian Geissler, Georg Seidemann, Thomas Wagner +1 more | 2018-10-30 |