Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making

Ultrathin bridge and multi-die ultrafine pitch patch architecture and method of making

US Patent 11756889 · Granted Sep 12, 2023

Estimated economic value: $19,004,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of photonic system with vertically stacked dies having plan2025
Package architecture of scalable compute wall having compute bricks with vertica2025
Package architecture of scalable compute wall having compute bricks with vertica2025
BGA stiffener attachment with low Eolife adhesive strength at high solder joint 2025
Ultra-thin, hyper-density semiconductor packages2025
Ultra-thin, hyper-density semiconductor packages2025
Ultra-thin, hyper-density semiconductor packages2025
Multi-chip packaging2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Moisture seal coating of hybrid bonded stacked die package assembly2025
Nested glass packaging architecture for hybrid electrical and optical communicat2025