Issued Patents All Time
Showing 26–46 of 46 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10727160 | Thermal management component | Devdatta P. Kulkarni, Richard J. Dischler | 2020-07-28 |
| 10600699 | Apparatus for inspection of a package assembly with a thermal solution | Aastha Uppal, Shankar Devasenathipathy, Joseph B. Petrini | 2020-03-24 |
| 10468331 | Heat management system | Jae Whan Kim, Ravindranath V. Mahajan, Blake Rogers, Devdatta P. Kulkarni | 2019-11-05 |
| 10228735 | Methods of direct cooling of packaged devices and structures formed thereby | Devdatta P. Kulkarni, Richard J. Dischler | 2019-03-12 |
| 9686888 | Heat dissipation lid having direct liquid contact conduits | David W. Song | 2017-06-20 |
| 9574832 | Enabling an aluminum heat exchanger with a working fluid | Choong-Un Kim, Himanshu Pokharna, Rajiv K. Mongia | 2017-02-21 |
| 9477275 | Thermal management solution for circuit products | Arnab Choudhury, David W. Song, Edvin Cetegen, Ashish Gupta | 2016-10-25 |
| 8673626 | Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof | Seung-Joo Kang | 2014-03-18 |
| 7592697 | Microelectronic package and method of cooling same | Leonel Arana, Michael Newman | 2009-09-22 |
| 7471515 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment | Gregory M. Chrysler | 2008-12-30 |
| 7332314 | Biosensor for analyzing quantitatively analyte with a predetermined size and larger than, and manufacturing method thereof | Seung-Joo Kang | 2008-02-19 |
| 7317615 | Integrated circuit coolant microchannel assembly with manifold member that facilitates coolant line attachment | Gregory M. Chrysler | 2008-01-08 |
| 7309453 | Coolant capable of enhancing corrosion inhibition, system containing same, and method of manufacturing same | Choong-Un Kim, Balu Pathangey, Paul J. Gwin, Mark E. Luke, Ravi Prasher | 2007-12-18 |
| 7283360 | Enhanced flow channel for component cooling in computer systems | Himanshu Pokharna | 2007-10-16 |
| 7259965 | Integrated circuit coolant microchannel assembly with targeted channel configuration | Ioan Sauciuc, Chuan Hu, Chia-Pin Chiu, Gregory M. Chrysler, Ravi Prasher +3 more | 2007-08-21 |
| 7243705 | Integrated circuit coolant microchannel with compliant cover | Alan M. Myers, Ravi Prasher, Ioan Sauciuc, Gregory M. Chrysler, Patrick D. Boyd +1 more | 2007-07-17 |
| 7131487 | Use of adjusted evaporator section area of heat pipe that is sized to match the surface area of an integrated heat spreader used in CPU packages in mobile computers | Eric Distefano | 2006-11-07 |
| 7123479 | Enhanced flow channel for component cooling in computer systems | Himanshu Pokharna | 2006-10-17 |
| 7104313 | Apparatus for using fluid laden with nanoparticles for application in electronic cooling | Himanshu Pokharna, Rajiv K. Mongia, Ravi Prasher, Sridhar Machiroutu, John W. Horigan | 2006-09-12 |
| 6867977 | Method and apparatus for protecting thermal interfaces | Eric Distefano | 2005-03-15 |
| 6621698 | Computer assembly providing cooling for more than one electronic component | — | 2003-09-16 |