Issued Patents All Time
Showing 1–25 of 43 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12328816 | Asymmetrical laminated circuit boards for improved electrical performance | Jackson Chung Peng Kong, Bok Eng Cheah, Tin Poay Chuah, Seok Ling Lim | 2025-06-10 |
| 12256487 | Hybrid boards with embedded planes | Jackson Chung Peng Kong, Bok Eng Cheah, Seok Ling Lim, Chin Lee Kuan, Tin Poay Chuah | 2025-03-18 |
| 12218064 | Molded silicon interconnects in bridges for integrated-circuit packages | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2025-02-04 |
| 12191281 | Multi-chip package with recessed memory | Bok Eng Cheah, Yang Liang Poh, Seok Ling Lim, Jackson Chung Peng Kong | 2025-01-07 |
| 12183722 | Molded interconnects in bridges for integrated-circuit packages | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2024-12-31 |
| 12142570 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi, Seok Ling Lim | 2024-11-12 |
| 12002747 | Integrated bridge for die-to-die interconnects | Bok Eng Cheah, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong | 2024-06-04 |
| 11955431 | Interposer structures and methods for 2.5D and 3D packaging | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Saravanan Sethuraman | 2024-04-09 |
| 11887940 | Integrated circuit packages with conductive element having cavities housing electrically connected embedded components | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2024-01-30 |
| 11676910 | Embedded reference layers for semiconductor package substrates | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2023-06-13 |
| 11574877 | Semiconductor miniaturization through component placement on stepped stiffener | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2023-02-07 |
| 11562954 | Frame-array interconnects for integrated-circuit packages | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2023-01-24 |
| 11527485 | Electrical shield for stacked heterogeneous device integration | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-12-13 |
| 11527467 | Multi-chip package with extended frame | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-12-13 |
| 11527463 | Hybrid ball grid array package for high speed interconnects | Bok Eng Cheah, Seok Ling Lim, Kooi Chi Ooi, Jackson Chung Peng Kong | 2022-12-13 |
| 11521932 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Ping Ping Ooi, Seok Ling Lim | 2022-12-06 |
| 11521943 | Method of forming a capacitive loop substrate assembly | Tin Poay Chuah, Chin Lee Kuan | 2022-12-06 |
| 11508650 | Interposer for hybrid interconnect geometry | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-11-22 |
| 11508660 | Molded power delivery interconnect module for improved Imax and power integrity | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2022-11-22 |
| 11476198 | Multi-level components for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim, Kok Keng Wan | 2022-10-18 |
| 11462488 | Substrate cores for warpage control | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2022-10-04 |
| 11430764 | Overhang bridge interconnect | Bok Eng Cheah, Seok Ling Lim, Jackson Chung Peng Kong, Kooi Chi Ooi | 2022-08-30 |
| 11367673 | Semiconductor package with hybrid through-silicon-vias | Seok Ling Lim, Bok Eng Cheah, Jackson Chung Peng Kong | 2022-06-21 |
| 11342289 | Vertical power plane module for semiconductor packages | Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim, Kooi Chi Ooi | 2022-05-24 |
| 11289427 | Multi-faceted integrated-circuit dice and packages | Bok Eng Cheah, Jackson Chung Peng Kong, Seok Ling Lim | 2022-03-29 |