Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12191281 | Multi-chip package with recessed memory | Bok Eng Cheah, Seok Ling Lim, Jenny Shio Yin Ong, Jackson Chung Peng Kong | 2025-01-07 |
| 11887917 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2024-01-30 |
| 11545434 | Vertical die-to-die interconnects bridge | Bok Eng Cheah, Kooi Chi Ooi | 2023-01-03 |
| 11456516 | Low loss high-speed interconnects | Ling Li Ong, Kin Wai Lee, Bok Eng Cheah, Yean Ling Soon | 2022-09-27 |
| 11049801 | Encapsulated vertical interconnects for high-speed applications and methods of assembling same | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-06-29 |