| 12142570 |
Composite bridge die-to-die interconnects for integrated-circuit packages |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim |
2024-11-12 |
$28,491,000 |
| 12002793 |
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization |
Eng Huat Goh, Wee Hoe, Khang Choong Yong |
2024-06-04 |
$24,500,000 |
| 11837458 |
Substrate with gradiated dielectric for reducing impedance mismatch |
Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi |
2023-12-05 |
$33,749,000 |
| 11521932 |
Composite bridge die-to-die interconnects for integrated-circuit packages |
Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim |
2022-12-06 |
$14,727,000 |
| 11355458 |
Interconnect core |
Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi |
2022-06-07 |
$12,864,000 |
| 11164827 |
Substrate with gradiated dielectric for reducing impedance mismatch |
Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi |
2021-11-02 |
$26,002,000 |
| 11121074 |
Packaged die stacks with stacked capacitors and methods of assembling same |
Bok Eng Cheah, Mooi Ling Chang, Jackson Chung Peng Kong, Wen Wei Lum |
2021-09-14 |
$31,644,000 |
| 11114421 |
Integrating system in package (SiP) with input/output (IO) board for platform miniaturization |
Eng Huat Goh, Wee Hoe, Khang Choong Yong |
2021-09-07 |
$31,495,000 |
| 10998261 |
Over-molded IC package with in-mold capacitor |
Jackson Chung Peng Kong, Bok Eng Cheah, Wen Wei Lum, Mooi Ling Chang |
2021-05-04 |
$37,420,000 |
| 10980108 |
Multi-conductor interconnect structure for a microelectronic device |
Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi |
2021-04-13 |
$58,007,000 |
| 10916524 |
Stacked dice systems |
Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi |
2021-02-09 |
$44,388,000 |
| 10593618 |
Packaged die stacks with stacked capacitors and methods of assembling same |
Bok Eng Cheah, Mooi Ling Chang, Jackson Chung Peng Kong, Wen Wei Lum |
2020-03-17 |
$21,927,000 |
| 10541200 |
Over-molded IC packages with embedded voltage reference plane and heater spreader |
Bok Eng Cheah, Jackson Chung Peng Kong, Mooi Ling Chang, Wen Wei Lum |
2020-01-21 |
$31,546,000 |
| 10403604 |
Stacked package assembly with voltage reference plane |
Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi, Shanggar Periaman |
2019-09-03 |
$18,715,000 |
| 10388636 |
Integrating system in package (SIP) with input/output (IO) board for platform miniaturization |
Eng Huat Goh, Wee Hoe, Khang Choong Yong |
2019-08-20 |
$17,708,000 |
| 10317938 |
Apparatus utilizing computer on package construction |
Eng Huat Goh, Khai Ern See, Damien Weng Kong Chong, Min Suet Lim, Chu Aun Lim +6 more |
2019-06-11 |
$16,707,000 |
| 9543244 |
Hybrid package transmission line circuits |
Chung Peng Jackson Kong, Chang-Tsung Fu, Telesphor Kamgaing, Chan Kim Lee |
2017-01-10 |
$11,357,000 |
| 8890302 |
Hybrid package transmission line circuits |
Chung Peng Jackson Kong, Chang-Tsung Fu, Telesphor Kamgaing, Chan Kim Lee |
2014-11-18 |
$17,555,000 |
