Issued Patents All Time
Showing 1–18 of 18 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12142570 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2024-11-12 |
| 12002793 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Khang Choong Yong | 2024-06-04 |
| 11837458 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi | 2023-12-05 |
| 11521932 | Composite bridge die-to-die interconnects for integrated-circuit packages | Bok Eng Cheah, Jackson Chung Peng Kong, Jenny Shio Yin Ong, Seok Ling Lim | 2022-12-06 |
| 11355458 | Interconnect core | Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi | 2022-06-07 |
| 11164827 | Substrate with gradiated dielectric for reducing impedance mismatch | Jackson Chung Peng Kong, Bok Eng Cheah, Kooi Chi Ooi | 2021-11-02 |
| 11121074 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Mooi Ling Chang, Jackson Chung Peng Kong, Wen Wei Lum | 2021-09-14 |
| 11114421 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Khang Choong Yong | 2021-09-07 |
| 10998261 | Over-molded IC package with in-mold capacitor | Jackson Chung Peng Kong, Bok Eng Cheah, Wen Wei Lum, Mooi Ling Chang | 2021-05-04 |
| 10980108 | Multi-conductor interconnect structure for a microelectronic device | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-04-13 |
| 10916524 | Stacked dice systems | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi | 2021-02-09 |
| 10593618 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Mooi Ling Chang, Jackson Chung Peng Kong, Wen Wei Lum | 2020-03-17 |
| 10541200 | Over-molded IC packages with embedded voltage reference plane and heater spreader | Bok Eng Cheah, Jackson Chung Peng Kong, Mooi Ling Chang, Wen Wei Lum | 2020-01-21 |
| 10403604 | Stacked package assembly with voltage reference plane | Bok Eng Cheah, Jackson Chung Peng Kong, Kooi Chi Ooi, Shanggar Periaman | 2019-09-03 |
| 10388636 | Integrating system in package (SIP) with input/output (IO) board for platform miniaturization | Eng Huat Goh, Wee Hoe, Khang Choong Yong | 2019-08-20 |
| 10317938 | Apparatus utilizing computer on package construction | Eng Huat Goh, Khai Ern See, Damien Weng Kong Chong, Min Suet Lim, Chu Aun Lim +6 more | 2019-06-11 |
| 9543244 | Hybrid package transmission line circuits | Chung Peng Jackson Kong, Chang-Tsung Fu, Telesphor Kamgaing, Chan Kim Lee | 2017-01-10 |
| 8890302 | Hybrid package transmission line circuits | Chung Peng Jackson Kong, Chang-Tsung Fu, Telesphor Kamgaing, Chan Kim Lee | 2014-11-18 |