Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374612 | Microelectronic device packages and related methods and systems | Kelvin Tan Aik Boo, Hong Wan Ng | 2025-07-29 |
| 11121074 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Mooi Ling Chang, Ping Ping Ooi, Jackson Chung Peng Kong | 2021-09-14 |
| 10998261 | Over-molded IC package with in-mold capacitor | Jackson Chung Peng Kong, Bok Eng Cheah, Mooi Ling Chang, Ping Ping Ooi | 2021-05-04 |
| 10593618 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Mooi Ling Chang, Ping Ping Ooi, Jackson Chung Peng Kong | 2020-03-17 |
| 10541200 | Over-molded IC packages with embedded voltage reference plane and heater spreader | Ping Ping Ooi, Bok Eng Cheah, Jackson Chung Peng Kong, Mooi Ling Chang | 2020-01-21 |