Issued Patents All Time
Showing 1–19 of 19 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12432859 | Surface mount device bonded to an inner layer of a multi-layer substrate | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2025-09-30 |
| 12431418 | Three dimensional semiconductor trace length matching and associated systems and methods | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2025-09-30 |
| 12412811 | Split via structure for semiconductor device packaging | Hong Wan Ng, Seng Kim Ye, Ling Pan, See Hiong Leow | 2025-09-09 |
| 12374612 | Microelectronic device packages and related methods and systems | Wen Wei Lum, Hong Wan Ng | 2025-07-29 |
| 12362319 | Cross stack bridge bonding devices and associated methods | Seng Kim Ye, Hong Wan Ng, Chin Hui Chong | 2025-07-15 |
| 12362255 | Apparatus including direct-contact heat paths and methods of manufacturing the same | Hong Wan Ng, Seng Kim Ye, Chin Hui Chong | 2025-07-15 |
| 12354939 | Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the same | Hong Wan Ng, Chin Hui Chong, Seng Kim Ye | 2025-07-08 |
| 12293992 | Semiconductor assemblies with systems and methods for managing high die stack structures | Seng Kim Ye, Chin Hui Chong, Hong Wan Ng | 2025-05-06 |
| 12243807 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Hem Takiar, Seng Kim Ye | 2025-03-04 |
| 12237301 | Through stack bridge bonding devices and associated methods | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng | 2025-02-25 |
| 12148736 | Three-dimensional bonding scheme and associated systems and methods | Hong Wan Ng, Seng Kim Ye, Chin Hui Chong | 2024-11-19 |
| 11929351 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2024-03-12 |
| 11894289 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Hem Takiar, Seng Kim Ye | 2024-02-06 |
| 11723150 | Surface mount device bonded to an inner layer of a multi-layer substrate | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2023-08-08 |
| 11710722 | Semiconductor assemblies with systems and methods for managing high die stack structures | Seng Kim Ye, Chin Hui Chong, Hong Wan Ng | 2023-07-25 |
| 11688662 | Thermal distribution network for semiconductor devices and associated systems and methods | Ling Pan, Sook Har Leong | 2023-06-27 |
| 11562987 | Semiconductor devices with multiple substrates and die stacks | Chin Hui Chong, Hong Wan Ng, Hem Takiar, Seng Kim Ye | 2023-01-24 |
| 11527459 | Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods | Hong Wan Ng, Chin Hui Chong, Hem Takiar, Seng Kim Ye | 2022-12-13 |
| 11282811 | Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer | Chin Hui Chong, Seng Kim Ye, Hong Wan Ng, Hem Takiar | 2022-03-22 |