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Jackson Chung Peng Kong, Bok Eng Cheah, Wen Wei Lum, Ping Ping Ooi |
2021-05-04 |
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Packaged die stacks with stacked capacitors and methods of assembling same |
Bok Eng Cheah, Ping Ping Ooi, Jackson Chung Peng Kong, Wen Wei Lum |
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Ping Ping Ooi, Bok Eng Cheah, Jackson Chung Peng Kong, Wen Wei Lum |
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Integrated circuit packages |
Min Suet Lim, Jiun Hann Sir, Eng Huat Eh Goh |
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2019-05-21 |
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Embedding thin film resistors in substrates in power delivery networks |
Myitzu Soe Myat, Eu Soon Lee, Yongki Min, King Keong Wong |
2012-07-24 |