Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12349276 | Co-planar interconnection mechanisms for circuit boards | Tin Poay Chuah, Eng Huat Goh, Min Suet Lim, Twan Sing Loo | 2025-07-01 |
| 11696409 | Vertical embedded component in a printed circuit board blind hole | Tin Poay Chuah, Min Suet Lim, Hoay Tien Teoh, Chin Lee Kuan | 2023-07-04 |
| 11121074 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Ping Ping Ooi, Jackson Chung Peng Kong, Wen Wei Lum | 2021-09-14 |
| 11096284 | Compact semiconductor chip system and method | Wee Hoe, Chan Kim Lee, Chee Chun Yee, Siang Yeong Tan, Say Thong Tony Tan | 2021-08-17 |
| 10998261 | Over-molded IC package with in-mold capacitor | Jackson Chung Peng Kong, Bok Eng Cheah, Wen Wei Lum, Ping Ping Ooi | 2021-05-04 |
| 10593618 | Packaged die stacks with stacked capacitors and methods of assembling same | Bok Eng Cheah, Ping Ping Ooi, Jackson Chung Peng Kong, Wen Wei Lum | 2020-03-17 |
| 10541200 | Over-molded IC packages with embedded voltage reference plane and heater spreader | Ping Ping Ooi, Bok Eng Cheah, Jackson Chung Peng Kong, Wen Wei Lum | 2020-01-21 |
| 10515912 | Integrated circuit packages | Min Suet Lim, Jiun Hann Sir, Eng Huat Eh Goh | 2019-12-24 |
| 10297541 | Multiple-component substrate for a microelectronic device | Min Suet Lim, Eng Huat Goh, Say Thong Tony Tan, Tin Poay Chuah | 2019-05-21 |
| 8228680 | Embedding thin film resistors in substrates in power delivery networks | Myitzu Soe Myat, Eu Soon Lee, Yongki Min, King Keong Wong | 2012-07-24 |