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Mooi Ling Chang — 11 Patents

Intel: 10 patents #4,072 of 30,777Top 15%
Bayan Lepas, MY: #13 of 266 inventorsTop 5%
Overall (All Time): #435,149 of 4,157,543Top 15%
11 Patents All Time
Mooi Ling Chang has been granted 11 US patents while listed as an inventor at Intel. The first was granted in 2012 and the most recent in October 2025. Mooi Ling Chang ranks #435,149 of 4,157,543 US inventors in our database (top 10.5%). Patent records list Mooi Ling Chang in Bayan Lepas, MY.

Patents per Year

Patents granted per year, 2012 to 2025Bar chart with a peak of 3 patents in 2021.peak 32012: 1 patents20122019: 2 patents20192020: 2 patents20202021: 3 patents20212023: 1 patents20232025: 2 patents2025

Issued Patents All Time

Showing 1–11 of 11 patents

Patent #TitleCo-InventorsDateApprox Value ⓘ
12447292 Inhaler monitoring acoustic box Yu-Tswan Hsu 2025-10-21
12349276 Co-planar interconnection mechanisms for circuit boards Tin Poay Chuah, Eng Huat Goh, Min Suet Lim, Twan Sing Loo 2025-07-01
11696409 Vertical embedded component in a printed circuit board blind hole Tin Poay Chuah, Min Suet Lim, Hoay Tien Teoh, Chin Lee Kuan 2023-07-04
11121074 Packaged die stacks with stacked capacitors and methods of assembling same Bok Eng Cheah, Ping Ping Ooi, Jackson Chung Peng Kong, Wen Wei Lum 2021-09-14 $31,644,000
11096284 Compact semiconductor chip system and method Wee Hoe, Chan Kim Lee, Chee Chun Yee, Siang Yeong Tan, Say Thong Tony Tan 2021-08-17 $29,127,000
10998261 Over-molded IC package with in-mold capacitor Jackson Chung Peng Kong, Bok Eng Cheah, Wen Wei Lum, Ping Ping Ooi 2021-05-04 $37,420,000
10593618 Packaged die stacks with stacked capacitors and methods of assembling same Bok Eng Cheah, Ping Ping Ooi, Jackson Chung Peng Kong, Wen Wei Lum 2020-03-17 $21,927,000
10541200 Over-molded IC packages with embedded voltage reference plane and heater spreader Ping Ping Ooi, Bok Eng Cheah, Jackson Chung Peng Kong, Wen Wei Lum 2020-01-21 $31,546,000
10515912 Integrated circuit packages Min Suet Lim, Jiun Hann Sir, Eng Huat Eh Goh 2019-12-24 $26,956,000
10297541 Multiple-component substrate for a microelectronic device Min Suet Lim, Eng Huat Goh, Say Thong Tony Tan, Tin Poay Chuah 2019-05-21 $20,944,000
8228680 Embedding thin film resistors in substrates in power delivery networks Myitzu Soe Myat, Eu Soon Lee, Yongki Min, King Keong Wong 2012-07-24 $18,521,000

Frequent Collaborators

Ping Ping Ooi4 shared
Wen Wei Lum4 shared
Bok Eng Cheah4 shared
Min Suet Lim4 shared
Jackson Chung Peng Kong4 shared
Tin Poay Chuah3 shared

Nearby-Ranked Inventors

Ya-Ching Chang11
Hermann Lubbert11
Alexander WAITE11
Mehrad Mehr11
Matthew J. Purdey11
Nishtha Madaan11
Ian C. Richards11
Chad Huffman11
Lifeng Fan11