| 11696409 |
Vertical embedded component in a printed circuit board blind hole |
Tin Poay Chuah, Min Suet Lim, Mooi Ling Chang, Chin Lee Kuan |
2023-07-04 |
| 11264315 |
Electronic package with passive component between substrates |
Eng Huat Goh, Min Suet Lim, Jiun Hann Sir, Jimmy Huang |
2022-03-01 |
| 10861839 |
Dynamic random access memory (DRAM) mounts |
Eng Huat Goh |
2020-12-08 |
| 10785872 |
Package jumper interconnect |
Eng Huat Goh |
2020-09-22 |
| 10492299 |
Electronic assembly that includes a substrate bridge |
Eng Huat Goh, Jia Yan Go, Jenny Shio Yin Ong |
2019-11-26 |
| 10411001 |
Dynamic random access memory (DRAM) mounts |
Eng Huat Goh |
2019-09-10 |
| 10163777 |
Interconnects for semiconductor packages |
Seok Ling Lim, Eng Huat Goh, Jenny Shio Yin Ong, Jia Yan Go, Jiun Hann Sir +1 more |
2018-12-25 |
| 9972589 |
Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layer |
Eng Huat Goh, Min Suet Lim, Jiun Hann Sir, Seok Ling Lim |
2018-05-15 |
| 9960224 |
Three capacitor stack and associated methods |
Eng Huat Goh, Jiun Hann Sir, Han Kung Chua, Min Suet Lim |
2018-05-01 |
| 9907170 |
FPC connector for better signal integrity and design compaction |
Eng Huat Goh |
2018-02-27 |
| 9613920 |
Microelectronic package utilizing multiple bumpless build-up structures and through-silicon vias |
Eng Huat Goh |
2017-04-04 |
| 9257368 |
Microelectric package utilizing multiple bumpless build-up structures and through-silicon vias |
Eng Huat Goh |
2016-02-09 |