Issued Patents All Time
Showing 25 most recent of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400952 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik | 2025-08-26 |
| 12349276 | Co-planar interconnection mechanisms for circuit boards | Mooi Ling Chang, Tin Poay Chuah, Min Suet Lim, Twan Sing Loo | 2025-07-01 |
| 12341121 | Through-substrate underfill formation for an integrated circuit assembly | Kyle Robert Davidson, Min Suet Lim, Kevin Byrd, James A. Wade | 2025-06-24 |
| 12002793 | Integrating system in package (SiP) with input/output (IO) board for platform miniaturization | Wee Hoe, Khang Choong Yong, Ping Ping Ooi | 2024-06-04 |
| 11929295 | Multi-use package architecture | Jiun Hann Sir, Min Suet Lim, Richard C. Stamey, Chu Aun Lim, Jimin Yao | 2024-03-12 |
| 11908793 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik | 2024-02-20 |
| 11823994 | Systems and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Jiun Hann Sir, Min Suet Lim | 2023-11-21 |
| 11699644 | Organic mold interconnects in shielded interconnects frames for integrated-circuit packages | Jiun Hann Sir, Poh Boon Khoo | 2023-07-11 |
| 11699664 | Wrappable EMI shields | Tin Poay Chuah, Yew San Lim, Min Suet Lim | 2023-07-11 |
| 11664317 | Reverse-bridge multi-die interconnect for integrated-circuit packages | Min Suet Lim, MD Altaf Hossain | 2023-05-30 |
| 11658127 | RFI free picture frame metal stiffener | Jiun Hann Sir, Khang Choong Yong, Boon Ping Koh, Wil Choon Song, Min Suet Lim | 2023-05-23 |
| 11658111 | Stripped redistrubution-layer fabrication for package-top embedded multi-die interconnect bridge | Jiun Hann Sir, Poh Boon Khoo, Amruthavalli Pallavi Alur, Debendra Mallik | 2023-05-23 |
| 11652057 | Disaggregated die interconnection with on-silicon cavity bridge | Khang Choong Yong, Min Suet Lim, Robert L. Sankman, Telesphor Kamgaing, Wil Choon Song +1 more | 2023-05-16 |
| 11587844 | Electronic device package on package (POP) | Jiun Hann Sir, Min Suet Lim, Xi Guo | 2023-02-21 |
| 11589460 | System in package dual connector | Tin Poay Chuah, Min Suet Lim, Chee Chun Yee, Yew San Lim | 2023-02-21 |
| 11552403 | Slot antenna on a printed circuit board (PCB) | Min Suet Lim, Boon Ping Koh, Wil Choon Song, Khang Choong Yong | 2023-01-10 |
| 11538633 | Combination stiffener and capacitor | Jiun Hann Sir, Min Suet Lim | 2022-12-27 |
| 11445608 | Chassis interconnect for an electronic device | Chee How Lim, Jon Sern Lim, Khai Ern See, Min Suet Lim, Tin Poay Chuah +1 more | 2022-09-13 |
| 11393760 | Floating-bridge interconnects and methods of assembling same | Boon Ping Koh, Jiun Hann Sir, Khang Choong Yong, Min Suet Lim, Wil Choon Song | 2022-07-19 |
| 11322434 | Top-to-bottom interconnects with molded lead-frame module for integrated-circuit packages | Jiun Hann Sir, Poh Boon Khoo | 2022-05-03 |
| 11304299 | Board to board interconnect | Chee Ling Wong, Wil Choon Song, Khang Choong Yong, Mohd Muhaiyiddin Bin Abdullah, Tin Poay Chuah | 2022-04-12 |
| 11289414 | Systems, methods, and apparatuses for implementing a pad on solder mask (POSM) semiconductor substrate package | Jiun Hann Sir, Min Suet Lim | 2022-03-29 |
| 11264160 | Extended package air core inductor | Jiun Hann Sir, Min Suet Lim, Chin Lee Kuan, Siew Fong Yap | 2022-03-01 |
| 11264315 | Electronic package with passive component between substrates | Min Suet Lim, Jiun Hann Sir, Hoay Tien Teoh, Jimmy Huang | 2022-03-01 |
| 11211714 | Slot antenna on a printed circuit board (PCB) | Min Suet Lim, Boon Ping Koh, Wil Choon Song, Khang Choong Yong | 2021-12-28 |