Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12341121 | Through-substrate underfill formation for an integrated circuit assembly | Eng Huat Goh, Kyle Robert Davidson, Min Suet Lim, Kevin Byrd | 2025-06-24 |
| 6439143 | Garment portion processing assembly | William D. Crahen | 2002-08-27 |
| 5438813 | Method for insulating walls of furnace | — | 1995-08-08 |
| 4848055 | Center mounted insulating module for a furnace | — | 1989-07-18 |
| 4640735 | Cylinder assembly covering remover | Leroy J. Murray, Lawrence N. Olson, Robert Chavoya | 1987-02-03 |