Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12341121 | Through-substrate underfill formation for an integrated circuit assembly | Eng Huat Goh, Kyle Robert Davidson, Min Suet Lim, James A. Wade | 2025-06-24 | |
| 10701796 | Electromagnetic interference (EMI) shield | Tin Poay Chuah, Yew San Lim, Khai Ern See, Khang Choong Yong | 2020-06-30 | $33,333,000 |
| 10548249 | Shielding in electronic assemblies | Scott M. Mokler, Timothy Swettlen | 2020-01-28 | $38,246,000 |
| 10305529 | Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices | David Pidwerbecki, Mark Gallina, Mark Hemmeyer, Steven J. Lofland, Ponniah Ilavarasan +1 more | 2019-05-28 | $17,387,000 |