Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10305529 | Using materials to increase structural rigidity, decrease size, improve safety, enhance thermal performance and speed charging in small form factor devices | David Pidwerbecki, Mark Gallina, Mark Hemmeyer, Steven J. Lofland, Michael Edwin Stewart +1 more | 2019-05-28 |
| 6706974 | Plane splits filled with lossy materials | Juan Chen, Adam Norman | 2004-03-16 |