Issued Patents All Time
Showing 25 most recent of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362236 | Method of producing an integrated circuit chip including a back-side power delivery network | Anabela Veloso, Anne Jourdain | 2025-07-15 |
| 12342503 | Device and system for cooling an electronic component | Vladimir Cherman, Herman Oprins | 2025-06-24 |
| 11810892 | Method of direct bonding semiconductor components | Jaber Derakhshandeh, Gerald Beyer | 2023-11-07 |
| 11769750 | Substrate, assembly and method for wafer-to-wafer hybrid bonding | Joeri De Vos | 2023-09-26 |
| 11476162 | Method for dicing a semiconductor substrate into a plurality of dies | Frank Holsteyns, Christophe Lorant, Simon Braun | 2022-10-18 |
| 11462420 | Method for packaging semiconductor dies | — | 2022-10-04 |
| 11367705 | Method for packaging semiconductor dies | — | 2022-06-21 |
| 11362061 | Method for the electrical bonding of semiconductor components | Lin Hou, Jaber Derakhshandeh, Ingrid De Wolf, Giovanni Capuz | 2022-06-14 |
| 11316066 | Method for fabricating an optical device | Soeren Steudel, Alexander Mityashin, Maarten Rosmeulen | 2022-04-26 |
| 10985057 | Method for contacting a buried interconnect rail of an integrated circuit chip from the back side of the IC | Anne Jourdain, Nouredine Rassoul | 2021-04-20 |
| 10886252 | Method of bonding semiconductor substrates | Lan Peng, Soon-Wook Kim, Gerald Beyer, Erik Sleeckx, Robert C. Miller | 2021-01-05 |
| 10797016 | Method for bonding semiconductor chips to a landing wafer | Vikas Dubey, Giovanni Capuz | 2020-10-06 |
| 10636739 | Integrated circuit chip with power delivery network on the backside of the chip | Julien Ryckaert | 2020-04-28 |
| 10332850 | Method for producing contact areas on a semiconductor substrate | Wenqi Zhang, Geraldine Jamieson, Bart Swinnen | 2019-06-25 |
| 10334755 | Liquid cooling of electronic devices | Herman Oprins, Vladimir Cherman | 2019-06-25 |
| 10271796 | Biocompatible packaging | Maria Op de Beeck, Philippe Soussan | 2019-04-30 |
| 10256183 | MIMCAP structure in a semiconductor device package | Mikael Detalle | 2019-04-09 |
| 10170450 | Method for bonding and interconnecting integrated circuit devices | Joeri De Vos, Stefaan Van Huylenbroeck | 2019-01-01 |
| 10141284 | Method of bonding semiconductor substrates | Soon-Wook Kim, Lan Peng, Patrick Verdonck, Robert C. Miller, Gerald Beyer | 2018-11-27 |
| 10066303 | Thin NiB or CoB capping layer for non-noble metallic bonding landing pads | Joeri De Vos, Jaber Derakhshandeh, Luke England, George Vakanas | 2018-09-04 |
| 9978710 | Method for self-aligned solder reflow bonding and devices obtained thereof | Vikas Dubey, Jaber Derakhshandeh | 2018-05-22 |
| 9966325 | Semiconductor die package and method of producing the package | — | 2018-05-08 |
| 9960080 | Method for bonding and interconnecting integrated circuit devices | — | 2018-05-01 |
| 9799632 | Method for aligning micro-electronic components | Vikas Dubey, Ingrid De Wolf | 2017-10-24 |
| 9646930 | Semiconductor device having through-substrate vias | Deniz Sabuncuoglu Tezcan, Yann Civale, Bart Swinnen | 2017-05-09 |