Issued Patents All Time
Showing 26–50 of 69 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9601459 | Method for aligning micro-electronic components | Vikas Dubey, Ingrid De Wolf | 2017-03-21 |
| 9508665 | Method for insertion bonding and device thus obtained | Paresh Limaye | 2016-11-29 |
| 9048198 | Biocompatible packaging | Maria Op de Beeck, Philippe Soussan | 2015-06-02 |
| 8907471 | Window interposed die packaging | Paresh Limaye | 2014-12-09 |
| 8822330 | Method for providing oxide layers | Philippe Soussan, Philippe Muller | 2014-09-02 |
| 8809188 | Method for fabricating through substrate vias | Deniz Sabuncuoglu Tezcan, Yann Civale, Bart Swinnen | 2014-08-19 |
| 8742590 | Method for forming isolation trenches | — | 2014-06-03 |
| 8735182 | Method for detecting embedded voids in a semiconductor substrate | Leonardus Leunissen, Sandip Halder | 2014-05-27 |
| 8647920 | Method for forming 3D-interconnect structures with airgaps | Deniz Sabuncuoglu Tezcan, Yann Civale | 2014-02-11 |
| 8536047 | Methods and systems for material bonding | Wenqi Zhang | 2013-09-17 |
| 8493736 | Device for cooling integrated circuits | Herman Oprins, Bart Vandevelde, Paolo Fiorini, Joeri De Vos, Bivragh Majeed | 2013-07-23 |
| 8450825 | Semiconductor package | Paresh Limaye, Jan Vanfleteren | 2013-05-28 |
| 8440504 | Method for aligning and bonding elements and a device comprising aligned and bonded elements | Philippe Soussan, Wouter Ruythooren, Koen De Munck | 2013-05-14 |
| 7880315 | Methods for bonding and micro-electronic devices produced according to such methods | Riet Labie | 2011-02-01 |
| 7835157 | System for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules | Hendrikus Tilmans, Henri Jansen, Walter De Raedt | 2010-11-16 |
| 7795113 | Method for bonding a die or substrate to a carrier | Bart Swinnen | 2010-09-14 |
| 7737552 | Device having a bonding structure for two elements | — | 2010-06-15 |
| 7687904 | Plurality of devices attached by solder bumps | Walter De Raedt, Steven Brebels, Steven Sanders, Tom Torfs | 2010-03-30 |
| 7566634 | Method for chip singulation | Bart Swinnen, Serge Vanhaelemeersch | 2009-07-28 |
| 7547625 | Methods for bonding and micro-electronic devices produced according to such methods | Riet Labie | 2009-06-16 |
| 7378297 | Methods of bonding two semiconductor devices | — | 2008-05-27 |
| 7368311 | Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules | Hendrikus Tilmans, Henri Jansen, Walter De Raedt | 2008-05-06 |
| 7205177 | Methods of bonding two semiconductor devices | Walter De Raedt, Steven Brebels, Steven Sanders, Tom Torfs | 2007-04-17 |
| 6908856 | Method for producing electrical through hole interconnects and devices made thereof | Riet Labie | 2005-06-21 |
| 6876056 | Method and system for fabrication of integrated tunable/switchable passive microwave and millimeter wave modules | Hendrikus Tilmans, Henri Jansen, Walter De Raedt | 2005-04-05 |