Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9508665 | Method for insertion bonding and device thus obtained | Eric Beyne | 2016-11-29 |
| 8907471 | Window interposed die packaging | Eric Beyne | 2014-12-09 |
| 8450825 | Semiconductor package | Jan Vanfleteren, Eric Beyne | 2013-05-28 |