Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12399071 | Compressible electrode | Herbert De Pauw, Matthias Willockx, Hugo De Winter, Sofie Moorkens | 2025-08-26 |
| 12127957 | Method for integrating an electronic circuit in or on a stent | Rik Verplancke | 2024-10-29 |
| 12125668 | Electron microscopy grid | Wouter VAN PUTTE, Jean-Pierre Timmermans | 2024-10-22 |
| 11740229 | Method and system for determining biomarker concentration | Patricia Khashayar | 2023-08-29 |
| 11406020 | Method of manufacturing a flat device | Frederick Bossuyt, Bart Plovie | 2022-08-02 |
| 9418927 | Stretchable electronic device | Fabrice Axisa, Frederick Bossuyt | 2016-08-16 |
| 9247648 | Stretchable electronic device | Frederick Bossuyt, Fabrice Axisa | 2016-01-26 |
| 8450825 | Semiconductor package | Paresh Limaye, Eric Beyne | 2013-05-28 |
| 8431828 | Composite substrate | Dominique Brosteaux, Fabrice Axisa | 2013-04-30 |
| 8207473 | Method for manufacturing a stretchable electronic device | Fabrice Axisa, Thomas Vervust | 2012-06-26 |
| 8182872 | Method of fabricating a porous elastomer | Fabrice Axisa, Pritesh Dagur | 2012-05-22 |
| 7759167 | Method for embedding dies | Wim Christiaens | 2010-07-20 |
| 7487587 | Methods of producing a composite substrate | Dominique Brosteaux, Fabrice Axisa | 2009-02-10 |
| 6555414 | Flip-chip assembly of semiconductor devices using adhesives | Sergei Stoukach, Bjorn Vandecasteele | 2003-04-29 |
| 6548327 | Low cost electroless plating process for single chips and wafer parts and products obtained thereof | Herbert De Pauw, Suixin Zhang | 2003-04-15 |