Issued Patents All Time
Showing 1–13 of 13 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12374675 | Method of producing hybrid semiconductor wafer | Gauri Karve, Yunlong Li, Luc Haspeslagh, Deniz Sabuncuoglu Tezcan | 2025-07-29 |
| 11282702 | Method of forming a semiconductor device structure | Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Olga Syshchyk, Bernardette Kunert +1 more | 2022-03-22 |
| 10481348 | Optical system for coupling light into a waveguide | Jeonghwan Song, Pol Van Dorpe, Giuseppe Fiorentino, Xavier Rottenberg | 2019-11-19 |
| 10271796 | Biocompatible packaging | Maria Op de Beeck, Eric Beyne | 2019-04-30 |
| 10128123 | Substrate structure with array of micrometer scale copper pillar based structures and method for manufacturing same | Bivragh Majeed | 2018-11-13 |
| 9929206 | Integrated circuit and method for manufacturing integrated circuit | Bart Vereecke, Deniz Sabuncuoglu Tezcan, Nicolaas Tack | 2018-03-27 |
| 9105621 | Method for bonding of group III-nitride device-on-silicon and devices obtained thereof | Melina Lofrano | 2015-08-11 |
| 9061897 | Methods for embedding conducting material and devices resulting from said methods | Alain Phommahaxay, Lieve Bogaerts | 2015-06-23 |
| 9048198 | Biocompatible packaging | Maria Op de Beeck, Eric Beyne | 2015-06-02 |
| 9000588 | Method for self-assembly of substrates and devices obtained thereof | Wenqi Zhang, Silvia Armini | 2015-04-07 |
| 8822330 | Method for providing oxide layers | Eric Beyne, Philippe Muller | 2014-09-02 |
| 8440504 | Method for aligning and bonding elements and a device comprising aligned and bonded elements | Wouter Ruythooren, Eric Beyne, Koen De Munck | 2013-05-14 |
| 8294976 | Method for reducing substrate charging | Ingrid De Wolf, Xavier Rottenberg, Piotr Czarnecki | 2012-10-23 |