| 12374675 |
Method of producing hybrid semiconductor wafer |
Gauri Karve, Yunlong Li, Luc Haspeslagh, Deniz Sabuncuoglu Tezcan |
2025-07-29 |
| 11282702 |
Method of forming a semiconductor device structure |
Vasyl Motsnyi, Luc Haspeslagh, Stefano Guerrieri, Olga Syshchyk, Bernardette Kunert +1 more |
2022-03-22 |
| 10481348 |
Optical system for coupling light into a waveguide |
Jeonghwan Song, Pol Van Dorpe, Giuseppe Fiorentino, Xavier Rottenberg |
2019-11-19 |
| 10271796 |
Biocompatible packaging |
Maria Op de Beeck, Eric Beyne |
2019-04-30 |
| 10128123 |
Substrate structure with array of micrometer scale copper pillar based structures and method for manufacturing same |
Bivragh Majeed |
2018-11-13 |
| 9929206 |
Integrated circuit and method for manufacturing integrated circuit |
Bart Vereecke, Deniz Sabuncuoglu Tezcan, Nicolaas Tack |
2018-03-27 |
| 9105621 |
Method for bonding of group III-nitride device-on-silicon and devices obtained thereof |
Melina Lofrano |
2015-08-11 |
| 9061897 |
Methods for embedding conducting material and devices resulting from said methods |
Alain Phommahaxay, Lieve Bogaerts |
2015-06-23 |
| 9048198 |
Biocompatible packaging |
Maria Op de Beeck, Eric Beyne |
2015-06-02 |
| 9000588 |
Method for self-assembly of substrates and devices obtained thereof |
Wenqi Zhang, Silvia Armini |
2015-04-07 |
| 8822330 |
Method for providing oxide layers |
Eric Beyne, Philippe Muller |
2014-09-02 |
| 8440504 |
Method for aligning and bonding elements and a device comprising aligned and bonded elements |
Wouter Ruythooren, Eric Beyne, Koen De Munck |
2013-05-14 |
| 8294976 |
Method for reducing substrate charging |
Ingrid De Wolf, Xavier Rottenberg, Piotr Czarnecki |
2012-10-23 |