Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9646930 | Semiconductor device having through-substrate vias | Yann Civale, Bart Swinnen, Eric Beyne | 2017-05-09 |
| 8809188 | Method for fabricating through substrate vias | Yann Civale, Bart Swinnen, Eric Beyne | 2014-08-19 |
| 8647920 | Method for forming 3D-interconnect structures with airgaps | Yann Civale, Eric Beyne | 2014-02-11 |